参数资料
型号: MCP1650S-E/MS
厂商: Microchip Technology
文件页数: 23/28页
文件大小: 0K
描述: IC REG CTRLR BST FLYBK PWM 8MSOP
标准包装: 100
PWM 型: 电流模式
输出数: 1
频率 - 最大: 850kHz
占空比: 80%
电源电压: 2.7 V ~ 5.5 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
包装: 管件
产品目录页面: 668 (CN2011-ZH PDF)
配用: MCP1650EV-ND - BOARD EVAL FOR MCP1650,51,52,53
MCP1650DM-LED1-ND - BOARD DEMO FOR MCP165X
MCP1650/51/52/53
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
E
E1
p
D
2
B
n
1
α
A
A2
c
β
(F)
L
φ
A1
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
p
.026 BSC
8
0.65 BSC
8
Overall Height
A
-
-
.043
- -
1.10
Molded Package Thickness
Standoff
A2
A1
.030
.000
.033
-
.037
.006
0.75
0.00
0.85
-
0.95
0.15
Overall Width
Molded Package Width
Overall Length
E
E1
D
.193 TYP.
.118 BSC
.118 BSC
4.90 BSC
3.00 BSC
3.00 BSC
Foot Length
L
.016 .024
.031
0.40
0.60
0.80
Footprint (Reference)
F
.037 REF
0.95 REF
Foot Angle
φ
0° - 8°
-
Lead Thickness
Lead Width
c
B
.003
.009
.006
.012
.009
.016
0.08
0.22
-
-
0.23
0.40
Mold Draft Angle Top
α
-
15°
5° -
15°
Mold Draft Angle Bottom
β
5° -
15°
5° -
15°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
? 2004 Microchip Technology Inc.
DS21876A-page 23
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