参数资料
型号: MCP1653ST-E/UN
厂商: Microchip Technology
文件页数: 21/28页
文件大小: 0K
描述: IC REG CTRLR BST FLYBK CM 10MSOP
标准包装: 2,500
PWM 型: 电流模式
输出数: 1
频率 - 最大: 850kHz
占空比: 80%
电源电压: 2.7 V ~ 5.5 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
包装: 带卷 (TR)
配用: MCP1650EV-ND - BOARD EVAL FOR MCP1650,51,52,53
MCP1650DM-LED1-ND - BOARD DEMO FOR MCP165X
MCP1650/51/52/53
Figure 6-2 represents the top wiring for the MCP1650/
51/52/53 application shown.
As shown in Figure 6-2, the high-current wiring is short
and wide. In this example, a 1 oz. copper layer is used
for both the top and bottom layers. The ground plane
connected to C2 and R4 are connected through the
vias (holes) connecting the top and bottom layer. The
feedback signal (from TP2) is wired from the output of
the regulator around the high current switching section
to the feedback voltage divider and to the FB pin of the
MCP1650/51/52/53.
Figure 6-3 represents the bottom wiring for the
MCP1650/51/52/53 application shown.
Silk-screen reference designator labels are transparent
from the top of the board. The analog ground plane and
power ground plane are connected near the ground
connection of the input capacitor (C 2 ). This prevents
high-power, ground-circulating currents from flowing
through the analog ground plane.
FIGURE 6-3:
Bottom Layer Wiring.
FIGURE 6-2:
Top Layer Wiring.
? 2004 Microchip Technology Inc.
DS21876A-page 21
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