参数资料
型号: MCP1700T-3002ETT
厂商: Microchip Technology Inc.
元件分类: 线性稳压
英文描述: Low Quiescent Current LDO
中文描述: 低静态电流低压降稳压器
文件页数: 10/24页
文件大小: 638K
代理商: MCP1700T-3002ETT
MCP1700
DS21826B-page 18
2007 Microchip Technology Inc.
3-Lead Plastic Transistor Outline (TO or ZB) [TO-92]
Notes:
1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
MAX
Number of Pins
N
3
Pitch
e
.050 BSC
Bottom to Package Flat
D
.125
.165
Overall Width
E
.175
.205
Overall Length
A
.170
.210
Molded Package Radius
R
.080
.105
Tip to Seating Plane
L
.500
Lead Thickness
c
.014
.021
Lead Width
b
.014
.022
E
A
N
1
L
b
e
c
R
D
1 2
3
Microchip Technology Drawing C04-101B
相关PDF资料
PDF描述
MCP1700T-3302EMB Low Quiescent Current LDO
MCP1700T-3302ETO Low Quiescent Current LDO
MCP1700T-3302ETT Low Quiescent Current LDO
MCP1700T-5002EMB Low Quiescent Current LDO
MCP1700T-5002ETO Low Quiescent Current LDO
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