参数资料
型号: MCP1700T-3002ETT
厂商: Microchip Technology Inc.
元件分类: 线性稳压
英文描述: Low Quiescent Current LDO
中文描述: 低静态电流低压降稳压器
文件页数: 8/24页
文件大小: 638K
代理商: MCP1700T-3002ETT
MCP1700
DS21826B-page 16
2007 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (TT or NB) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
3
Lead Pitch
e
0.95 BSC
Outside Lead Pitch
e1
1.90 BSC
Overall Height
A
0.89
1.12
Molded Package Thickness
A2
0.79
0.95
1.02
Standoff
A1
0.01
0.10
Overall Width
E
2.10
2.64
Molded Package Width
E1
1.16
1.30
1.40
Overall Length
D
2.67
2.90
3.05
Foot Length
L
0.13
0.50
0.60
Foot Angle
φ
10°
Lead Thickness
c
0.08
0.20
Lead Width
b
0.30
0.54
b
N
E
E1
2
1
e
e1
D
A
A1
A2
c
L
φ
Microchip Technology Drawing C04-104B
相关PDF资料
PDF描述
MCP1700T-3302EMB Low Quiescent Current LDO
MCP1700T-3302ETO Low Quiescent Current LDO
MCP1700T-3302ETT Low Quiescent Current LDO
MCP1700T-5002EMB Low Quiescent Current LDO
MCP1700T-5002ETO Low Quiescent Current LDO
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