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| 型号： | MCP1703T-2802E/DB |
| 厂商： | Microchip Technology |
| 文件页数： | 4/32页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.8V .25A SOT223-3 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.8V |
| 输入电压： | 最高 16V |
| 电压 - 压降（标准）： | 0.625V @ 250mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 250mA（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-261-4，TO-261AA |
| 供应商设备封装： | SOT-223-3 |
| 包装： | 标准包装 |
| 产品目录页面： | 667 (CN2011-ZH PDF) |
| 其它名称： | MCP1703T-2802E/DBDKR |
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MCP1703
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for V IN = V OUT(MAX) + V DROPOUT(MAX) , Note 1 ,
I LOAD = 100 μA, C OUT = 1 μF (X7R), C IN = 1 μF (X7R), T A = +25°C.
Boldface type applies for junction temperatures, T J ( Note 7 ) of -40°C to +125°C.
Parameters
Dropout Voltage
Symbol
V DROPOUT
Min
—
—
—
—
—
Typ
330
525
625
750
—
Max
650
725
975
1100
—
Units
mV
mV
mV
mV
mV
Conditions
I L = 250 mA, V R = 5.0V
I L = 250 mA, 3.3V ≤ V R < 5.0V
I L = 250 mA, 2.8V ≤ V R < 3.3V
I L = 250 mA, 2.5V ≤ V R < 2.8V
V R < 2.5V, See Maximum Output
Current Parameter
Output Delay Time
T DELAY
—
1000
—
μs
V IN = 0V to 6V, V OUT = 90% V R ,
R L = 50 Ω resistive
Output Noise
e N
—
8
μV/(Hz) 1/2 I L = 50 mA, f = 1 kHz, C OUT = 1 μF
Power Supply Ripple
PSRR
—
44
—
dB f = 100 Hz, C OUT = 1 μF, I L = 100 μA,
Rejection Ratio
V INAC = 100 mV pk-pk, C IN = 0 μF,
V R = 1.2V
Thermal Shutdown Protection
T SD
—
150
—
°C
Note 1:
2:
3:
4:
5:
6:
7:
The minimum V IN must meet two conditions: V IN ≥ 2.7V and V IN ≥ (V OUT(MAX) + V DROPOUT(MAX) ).
V R is the nominal regulator output voltage. For example: V R = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
The input voltage V IN = V OUT(MAX) + V DROPOUT(MAX) or Vi IN = 2.7V (whichever is greater); I OUT = 100 μA.
TCV OUT = (V OUT-HIGH - V OUT-LOW ) *10 6 / (V R * Δ Temperature), V OUT-HIGH = highest voltage measured over the
temperature range. V OUT-LOW = lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV OUT .
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of V OUT(MAX) + V DROPOUT(MAX) or 2.7V, whichever is greater.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T A , T J , θ JA ). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS ( 1 )
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
T J
T J
T A
-40
—
-65
—
—
—
+125
+150
+150
°C
°C
°C
Steady State
Transient
Thermal Resistance, 3LD SOT-223
Thermal Resistance, 3LD SOT-23A
Thermal Resistance, 3LD SOT-89
Thermal Resistance, 8LD 2x3 DFN
θ JA
θ JC
θ JA
θ JC
θ JA
θ JC
θ JA
θ JC
—
—
—
—
—
—
—
—
62
15
336
110
153,3
100
93
26
—
—
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
Note 1:
2:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T A , T J , θ JA ). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
Thermal Resistance values are subject to change. Please visit the Microchip web site for the latest packaging
information.
DS22049F-page 4
? 2011 Microchip Technology Inc.
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