参数资料
型号: MCP1790T-5002E/EB
厂商: Microchip Technology
文件页数: 19/34页
文件大小: 0K
描述: IC REG LDO 5V 70MA 3DDPAK
标准包装: 750
稳压器拓扑结构: 正,固定式
输出电压: 5V
输入电压: 6 V ~ 30 V
电压 - 压降(标准): 0.7V @ 70mA
稳压器数量: 1
电流 - 输出: 70mA(最小)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-263-4,D²Pak(3 引线+接片),TO-263AA
供应商设备封装: DDPAK/TO-263-3
包装: 带卷 (TR)
其它名称: MCP1790T-5002E/EBTR
MCP1790/MCP1791
5.3
Power Dissipation Example
5.3.1.2
Junction Temperature Estimate
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
are calculated in the following example. The power
dissipation, as a result of ground current, is small
enough to be neglected.
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below.
T J = T JRISE + T A(MAX)
5.3.1
Package:
POWER DISSIPATION EXAMPLE
5.3.1.3
T J = 99.2°C
Maximum Package Power
Package Type = SOT-223-5
Input Voltage:
V IN = 8V to 24V
LDO Output Voltages and Currents:
V OUT = 5.0V
I OUT = 50 mA
Maximum Ambient Temperature:
T A(MAX) = +40°C
Internal Power Dissipation:
Dissipation at +40°C Ambient
Temperature
SOT-223-5 (62°C/Watt = R θ JA )
P D(MAX) = (125°C - 40°C) / 62°C/W
P D(MAX) = 1.371 Watts
DDPAK-5 (32°C/Watt = R θ JA )
P D(MAX) = (125°C - 40°C) / 32°C/W
P D(MAX) = 2.656 Watts
Internal Power dissipation is the product of the LDO
5.4
Pulsed Load Applications
output current times the voltage across the LDO
(V IN to V OUT ).
P LDO(MAX) = (V IN(MAX) - V OUT(MIN) ) x I OUT(MAX)
P LDO = (24V - (0.98 x 5.0V)) x 50 mA
P LDO = 955 milli-Watts
5.3.1.1 Device Junction Temperature Rise
The internal junction temperature rise is a function of
internal power dissipation and the thermal resistance
from junction to ambient for the application. The
thermal resistance from junction to ambient (R θ JA ) is
derived from an EIA/JEDEC standard for measuring
thermal resistance for small surface mount packages.
The EIA/JEDEC specification is JESD51-7, “High
Effective Thermal Conductivity Test Board for Leaded
Surface Mount Packages”. The standard describes the
test method and board specifications for measuring the
thermal resistance from junction to ambient. The actual
thermal resistance for a particular application can vary
depending on many factors, such as copper area and
thickness. Refer to AN792, “A Method to Determine
How Much Power a SOT23 Can Dissipate in an
Application”, (DS00792), for more information
regarding this subject.
T J(RISE) = P TOTAL x Rq JA
T JRISE = 955 milli-Watts x 62 ° C/Watt
T JRISE = 59.2 ° C
? 2010 Microchip Technology Inc.
For some applications, there are pulsed load current
events that may exceed the specified 70 mA maximum
specification of the MCP1790/MCP1791. The internal
current foldback feature of the MCP1790/MCP1791 will
prevent high peak load demands from causing
non-recoverable damage. The Current Foldback
feature of the device will limit the output voltage and
output current during pulsed applications. As the
current rises above the foldback current threshold, the
output voltage will decrease.
DS22075B-page 19
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MCP1791-3002E/DC 功能描述:低压差稳压器 - LDO HI VLTG LDO 50 mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MCP1791-3002E/ET 功能描述:低压差稳压器 - LDO HI VLTG LDO 50 mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MCP1791-3302E/DC 功能描述:低压差稳压器 - LDO HI VLTG LDO 50 mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MCP1791-3302E/ET 功能描述:低压差稳压器 - LDO HI VLTG LDO 50 mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MCP1791-5002E/DC 功能描述:低压差稳压器 - LDO HI VLTG LDO 50 mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20