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| 型号： | MCP1801T-0902I/OT |
| 厂商： | Microchip Technology |
| 文件页数： | 17/28页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 0.9V .15A SOT23-5 |
| 标准包装： | 3,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 0.9V |
| 输入电压： | 2 V ~ 10 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 150mA（最小） |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SC-74A，SOT-753 |
| 供应商设备封装： | SOT-23-5 |
| 包装： | 带卷 (TR) |
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MCP1801
6.0
6.1
APPLICATION CIRCUITS AND
ISSUES
Typical Application
resistance from junction to ambient (R ? JA ). The thermal
resistance from junction to ambient for the SOT-23-5
pin package is estimated at 256°C/W.
EQUATION 6-2:
The MCP1801 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for many battery-powered
Where:
T J ? MAX ? = P TOTAL ? R ? JA + T AMAX
applications.
MCP1801
T J(MAX)
P TOTAL
=
=
Maximum continuous junction
temperature
Total device power dissipation
NC
SHDN
R ? JA
=
Thermal resistance from
junction to ambient
V OUT
1.8V
I OUT
50 mA
V OUT
C OUT
1 μF Ceramic
GND
V IN
V IN
2.4V to 5.0V
C IN
1 μF
Ceramic
T AMAX = Maximum ambient temperature
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
FIGURE 6-1:
Typical Application Circuit.
can be used to determine the package maximum
internal power dissipation.
6.1.1
APPLICATION INPUT CONDITIONS
EQUATION 6-3:
R ? JA
Package Type =
Input Voltage Range =
V IN maximum =
SOT-23-5
2.4V to 5.0V
5.0V
Where:
? T J ? MAX ? – T A ? MAX ? ?
P D ? MAX ? = ---------------------------------------------------
V OUT typical =
I OUT =
1.8V
50 mA maximum
P D(MAX)
=
Maximum device power
dissipation
6.2
Power Calculations
T J(MAX)
=
Maximum continuous junction
temperature
6.2.1 POWER DISSIPATION
The internal power dissipation of the MCP1801 is a
function of input voltage, output voltage, and output
T A(MAX)
R ? JA
=
=
Maximum ambient temperature
Thermal resistance from
junction to ambient
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(25.0 μA x V IN ). The following equation can be used to
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
EQUATION 6-4:
T J ? RISE ? = P D ? MAX ? ? R ? JA
Where:
P LDO = ? V IN ? MAX ? ? – V OUT ? MIN ? ? ? I OUT ? MAX ? ?
Where:
T J(RISE)
P TOTAL
=
=
Rise in device junction
temperature over the ambient
temperature
Maximum device power
P LDO
=
LDO Pass device internal power
dissipation
dissipation
R ? JA
=
Thermal resistance from
V IN(MAX)
V OUT(MIN)
=
=
Maximum input voltage
LDO minimum output voltage
junction to ambient
The maximum continuous operating temperature
specified for the MCP1801 is +85°C . To estimate the
internal junction temperature of the MCP1801, the total
internal power dissipation is multiplied by the thermal
? 2010 Microchip Technology Inc.
DS22051D-page 17
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| MCP1801T-1202I/OT | 功能描述:低压差稳压器 - LDO Hi PSRR 150 mA LDO Vin 10V maxVout 1.2V RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| MCP1801T-1802I/OT | 功能描述:低压差稳压器 - LDO Hi PSRR 150 mA LDO Vin 10V maxVout 1.8V RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| MCP1801T-2502E/OT | 制造商:Microchip Technology Inc 功能描述:HIGH PSRR 150 MA LDO, VIN 10V MAX, VOUT =2.5V SOT-23-5-TR - Tape and Reel |
| MCP1801T-2502I/OT | 功能描述:低压差稳压器 - LDO Hi PSRR 150 mA LDO Vin 10V maxVout 2.5V RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| MCP1801T-3002E/OT | 制造商:Microchip Technology Inc 功能描述:HIGH PSRR 150 MA LDO, VIN 10V MAX,VOUT =3.0V SOT-23-5-TR - Tape and Reel |
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