参数资料
型号: MCP2022P-330E/ST
厂商: Microchip Technology
文件页数: 32/52页
文件大小: 0K
描述: IC TXRX LIN ON-BOARD VREG 14TSSO
产品培训模块: Microchip MCP20xx LIN Transceiver Overview
标准包装: 96
系列: *
MCP2021/2/1P/2P
DS22018F-page 38
2005-2012 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
1.27 BSC
Overall Height
A
0.80
0.85
1.00
Standoff
A1
0.00
0.01
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
5.00 BSC
Overall Width
E
6.00 BSC
Exposed Pad Length
D2
3.90
4.00
4.10
Exposed Pad Width
E2
2.20
2.30
2.40
Contact Width
b
0.35
0.40
0.48
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
NOTE 2
A1
A
A3
NOTE 1
12
E
N
D
EXPOSED PAD
NOTE 1
2
1
E2
L
N
e
b
K
BOTTOM VIEW
TOP VIEW
D2
Microchip Technology Drawing C04-122B
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