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| 型号： | MCP23009-E/MG |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 8 I/O, PIA-GENERAL PURPOSE, PQCC16 |
| 封装： | 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, QFN-16 |
| 文件页数： | 13/50页 |
| 文件大小： | 607K |
| 代理商： | MCP23009-E/MG |
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MCP23009/MCP23S09
DS22121B-page 20
2009 Microchip Technology Inc.
1.6.5
INTERRUPT CONTROL REGISTER
The INTCON register controls how the associated pin
value is compared for the interrupt-on-change feature.
If a bit is set, the corresponding I/O pin is compared
against the associated bit in the DEFVAL register. If a
bit value is clear, the corresponding I/O pin is compared
against the previous value.
REGISTER 1-5:
INTCON – INTERRUPT-ON-CHANGE CONTROL REGISTER
R/W-0
IOC7
IOC6
IOC5
IOC4
IOC3
IOC2
IOC1
IOC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-0
IOC7:IOC0: Controls how the associated pin value is compared for interrupt-on-change <7:0>.
1
= Pin value is compared against the associated bit is DEFVAL register
0
= Pin value is compared against the previous pin value
Refer to DEFVAL and GPINTEN.
相关PDF资料 |
PDF描述 |
|---|---|
| MCP23009-E/SS | 8 I/O, PIA-GENERAL PURPOSE, PDSO20 |
| MCP23S09T-E/SS | 8 I/O, PIA-GENERAL PURPOSE, PDSO20 |
| MCP23S09T-E/SO | 8 I/O, PIA-GENERAL PURPOSE, PDSO18 |
| MCP23S09-E/MG | 8 I/O, PIA-GENERAL PURPOSE, PQCC16 |
| MCP23S09T-E/MG | 8 I/O, PIA-GENERAL PURPOSE, PQCC16 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MCP23009EP | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009ESO | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009ESS | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009T | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8-Bit I/O Expander with Open-Drain Outputs |
| MCP23009T-E/MG | 功能描述:接口 - 专用 8B I/O Expander SPI interface RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
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