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| 型号： | MCP23016-I/SP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16 I/O, PIA-GENERAL PURPOSE, PDIP28 |
| 封装： | 0.300 INCH, SKINNY, PLASTIC, DIP-28 |
| 文件页数： | 11/38页 |
| 文件大小： | 543K |
| 代理商： | MCP23016-I/SP |
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2007 Microchip Technology Inc.
DS20090C-page 19
MCP23016
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias................................................................................................................ -55 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS ......................................................................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +6.5V
Total power dissipation (Note 1) ............................................................................................................................ 1.0 W
Maximum current out of VSS pin .......................................................................................................................... 300 mA
Maximum current into VDD pin ............................................................................................................................. 250 mA
Input clamp current, IIK (VI < 0, or VI > VDD) .......................................................................................................
± 20 mA
Output clamp current, IOK (VO < 0, or VO > VDD) ................................................................................................
± 20 mA
Maximum output current sunk by any I/O pin......................................................................................................... 25 mA
Maximum output current sourced by any I/O pin ................................................................................................... 25 mA
Maximum current sunk by combined PORTS ...................................................................................................... 200 mA
Maximum current sourced by combined PORTS ................................................................................................ 200 mA
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
相关PDF资料 |
PDF描述 |
|---|---|
| MCP23S17T-E/SO | 16 I/O, PIA-GENERAL PURPOSE, PDSO28 |
| MCP23017-E/SP | 16 I/O, PIA-GENERAL PURPOSE, PDIP28 |
| MCP23S17-E/SS | 16 I/O, PIA-GENERAL PURPOSE, PDSO28 |
| MCP23S17T-E/ML | 16 I/O, PIA-GENERAL PURPOSE, PQCC28 |
| MCP23017-E/SO | 16 I/O, PIA-GENERAL PURPOSE, PDSO28 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MCP23016T-I/ML | 功能描述:接口-I/O扩展器 16 bit In/Out RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MCP23016T-I/SO | 功能描述:接口-I/O扩展器 16 bit In/Out RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MCP23016T-I/SS | 功能描述:接口-I/O扩展器 16 bit In/Out RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MCP23017 | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:16-Bit I/O Expander with Serial Interface |
| MCP23017-E/ML | 功能描述:接口-I/O扩展器 16bit Input/Output Exp I2C interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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