参数资料
型号: MCP23S08-E/SS
元件分类: 微控制器/微处理器
英文描述: 8 I/O, PIA-GENERAL PURPOSE, PDSO20
封装: 0.209 INCH, PLASTIC, SSOP-20
文件页数: 30/44页
文件大小: 649K
代理商: MCP23S08-E/SS
MCP23008/MCP23S08
DS21919E-page 36
2007 Microchip Technology Inc.
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
20
Pitch
e
0.50 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Width
E
4.00 BSC
Exposed Pad Width
E2
2.60
2.70
2.80
Overall Length
D
4.00 BSC
Exposed Pad Length
D2
2.60
2.70
2.80
Contact Width
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Contact-to-Exposed Pad
K
0.20
D
EXPOSED
PAD
E
E2
2
1
N
TOP VIEW
NOTE 1
N
L
K
b
e
D2
2
1
A
A1
A3
BOTTOM VIEW
Microchip Technology Drawing C04-126B
相关PDF资料
PDF描述
MCP23008-E/SO 8 I/O, PIA-GENERAL PURPOSE, PDSO18
MCP23009-E/MG 8 I/O, PIA-GENERAL PURPOSE, PQCC16
MCP23009-E/SS 8 I/O, PIA-GENERAL PURPOSE, PDSO20
MCP23S09T-E/SS 8 I/O, PIA-GENERAL PURPOSE, PDSO20
MCP23S09T-E/SO 8 I/O, PIA-GENERAL PURPOSE, PDSO18
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