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| 型号： | MCP23S18T-E/MJ |
| 厂商： | Microchip Technology |
| 文件页数： | 27/56页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER SPI 16B 24QFN |
| 标准包装： | 3,300 |
| 接口： | SPI |
| 输入/输出数： | 16 |
| 中断输出： | 是 |
| 频率 - 时钟： | 10MHz |
| 电源电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘 |
| 供应商设备封装： | 24-QFN（4x4） |
| 包装： | 带卷 (TR) |
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2008 Microchip Technology Inc.
DS22103A-page 33
MCP23018/MCP23S18
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings ()
Ambient temperature under bias............................................................................................................ .-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.0V
Voltage on RESET with respect to VSS ..................................................................................................... -0.3V to +14V
Voltage on all other pins with respect to VSS (except VDDand GPIOA/B) ...................................... -0.6V to (VDD + 0.6V)
Voltage on GPIO Pins: ................................................................................................................................. -0.6V to 5.5V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of VSS pin ...........................................................................................................................400 mA
Maximum current into VDD pin .............................................................................................................................. 125 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
...................................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
.............................................................................................................. ±20 mA
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sunk by any Output pin (VDD = 1.8V) ..............................................................................10 mA
Maximum output current sourced by any Output pin ..............................................................................................25 mA
Maximum output current sourced by any Output pin (VDD = 1.8V) .........................................................................10 mA
Note:
Power dissipation is calculated as follows:
Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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