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| 型号： | MCP25050-I/SL |
| 厂商： | Microchip Technology |
| 文件页数： | 47/66页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER CAN 8B 14SOIC |
| 标准包装： | 57 |
| 接口： | CAN |
| 输入/输出数： | 8 |
| 中断输出： | 无 |
| 频率 - 时钟： | 4MHz |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SOIC |
| 包装： | 管件 |
| 包括： | ADC，存储器，PWM |
| 产品目录页面： | 685 (CN2011-ZH PDF) |
| 其它名称： | MCP25050I/SL |
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2007 Microchip Technology Inc.
DS21664D-page 51
MCP2502X/5X
9.0
ELECTRICAL CHARACTERISTICS
9.1
Absolute Maximum Ratings
Ambient temperature under bias............................................................................................................. -55°C to +125°C
Storage temperature ............................................................................................................................... -65°C to +150°C
Voltage on any pin with respect to Vss (except VDD and RST)....................................................... -0.3V to (VDD + 0.6V)
VDD................................................................................................................................................................... 0V to 7.0V
Voltage on RST with respect to Vss.................................................................................................................. 0V to 14V
Total power dissipation (Note 1) .............................................................................................................................. 1.0 W
Maximum source current out of VSS pin ............................................................................................................... 300 mA
Maximum sink current into VDD pin ....................................................................................................................... 250 mA
Input clamp current, Iik (Vi < 0 or Vi > VDD) .......................................................................................................... ±20 mA
Output clamp current, Iok (VO < 0 or VO > VDD).................................................................................................... ±20 mA
Maximum current sunk by any I/O pin..................................................................................................................... 25 mA
Maximum current sourced by any input pin ............................................................................................................ 25 mA
Maximum current sunk by GPIO port.................................................................................................................... 200 mA
Maximum current sourced by GPIO port ..............................................................................................................200 mA
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
ESD protection on all pins
.................................................................................................................................................. ≥ 3.5 kV
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
FIGURE 9-1:
MCP2505X VOLTAGE-FREQUENCY GRAPH
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Frequency
Vo
lt
a
g
e
6.0V
5.5V
4.5V
4.0V
2.0V
25 MHz
5.0V
3.5V
3.0V
2.7V
Fmax = (9.44 MHz/V) (VDDAPPMIN - 2.7V) + 8 MHz
Note: VDDAPPMIN is the minimum voltage of the MCP2505X device in the application.
8MHz
4.5V
MCP2505X
Characterized and not 100% tested.
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