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参数资料
| 型号： | MCP3021A4T-E/OT |
| 厂商： | Microchip Technology |
| 文件页数： | 11/26页 |
| 文件大小： | 0K |
| 描述： | ADC 10BIT I2C INTERFACE SOT23-5 |
| 标准包装： | 1 |
| 位数： | 10 |
| 采样率（每秒）： | 22.3k |
| 数据接口： | I²C，串行 |
| 转换器数目： | 1 |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SC-74A，SOT-753 |
| 供应商设备封装： | SOT-23-5 |
| 包装： | 标准包装 |
| 输入数目和类型： | 1 个单端，单极 |
| 其它名称： | MCP3021A4T-E/OTDKR |
2003 Microchip Technology Inc.
DS21805A-page 19
MCP3021
6.3
Device Polling
In some instances, it may be necessary to test for
MCP3021 presence on the I2C bus without performing
a conversion, described in Figure 6-4. Here we are set-
ting the R/W bit in the address byte to a zero. The
MCP3021 will then acknowledge by pulling SDA low
during the ACK clock and then release the bus back to
the I2C master. A stop or repeated start bit can then be
issued from the master and I2C communication can
continue.
FIGURE 6-4:
Device Polling.
6.4
Device Power and Layout
Considerations
6.4.1
POWERING THE MCP3021
VDD supplies the power to the device as well as the ref-
erence voltage. A bypass capacitor value of 0.1 F is
recommended. Adding a 10 F capacitor in parallel is
recommended to attenuate higher frequency noise
present in some systems.
FIGURE 6-5:
Powering the MCP3021.
6.4.2
LAYOUT CONSIDERATIONS
When laying out a printed circuit board for use with
analog components, care should be taken to reduce
noise wherever possible. A bypass capacitor from VDD
to ground should always be used with this device and
should be placed as close as possible to the device pin.
A bypass capacitor value of 0.1 F is recommended.
Digital and analog traces should be separated as much
as possible on the board, with no traces running
underneath the device or the bypass capacitor. Extra
precautions should be taken to keep traces with high
frequency signals (such as clock lines) as far as
possible from analog traces.
The MCP3021 should be connected entirely to the ana-
log ground place, as well as the analog power trace.
The pull-up resistors can be placed close to the
microcontroller and tied to the digital power or VCC.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing VDD connections to
devices in a “star” configuration can also reduce noise
by eliminating current return paths and associated
errors (Figure 6-6). For more information on layout tips
when using the MCP3021 or other ADC devices, refer
to AN688, “Layout Tips for 12-Bit A/D Converter
Applications”.
FIGURE 6-6:
VDD traces arranged in a
‘Star’ configuration in order to reduce errors
caused by current return paths.
6.4.3
USING A REFERENCE FOR
SUPPLY
The MCP3021 uses VDD as power and also as a refer-
ence. In some applications, it may be necessary to use
a stable reference to achieve the required accuracy.
Figure 6-7 shows an example using the MCP1541 as a
4.096V 2% reference.
FIGURE 6-7:
Stable Power and
Reference Configuration.
123
456
78
9
SCL
SDA
1
00 1 A2A1A0 0
AC
K
Start
Bit
Address Byte
Address bits
Device bits
R/W
Start
Bit
MCP3021 response
VDD
AIN
SCL
SDA
To
Microcontroller
10 F
MCP3021
0.1 F
VCC
RPU
VDD
Connection
Device 1
Device 2
Device 3
Device 4
VDD
4.096V
Reference
1F
0.1 F
MCP1541
CL
AIN
To
Mi
cr
oc
o
ntr
ol
le
r
MCP3021
VCC
RPU
SCL
SDA
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