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| 型号： | MCP3901EV-MCU16 |
| 厂商： | Microchip Technology |
| 文件页数： | 16/30页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR 2CH ADC MCP3901 |
| 产品培训模块： | MCP3901 Analog Front End |
| 视频文件： | MCP3901 ADC Evaluation Board for 16-bit MCUs |
| 标准包装： | 1 |
| ADC 的数量： | 2 |
| 位数： | 24 |
| 数据接口： | SPI? |
| 输入范围： | ±1 V |
| 工作温度： | -40°C ~ 85°C |
| 已用 IC / 零件： | MCP3901 |
| 已供物品： | 板 |
| 产品目录页面： | 672 (CN2011-ZH PDF) |
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PCA2002
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 25 November 2011
23 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 17) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 17.
Table 16.
PCA2002 wafer information
Type number
Wafer thickness
Wafer diameter
FFC for wafer size
Marking of bad die
PCA2002U/10AB/1
0.20 mm
6 inch
inking
PCA2002CX8/5/1
0.69 mm
6 inch
wafer mapping
PCA2002CX8/12/1
0.20 mm
6 inch
8 inch
wafer mapping
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相关代理商/技术参数 |
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| MCP3901-I/SS | 功能描述:开关变换器、稳压器与控制器 Dual Ch Enrgy Metr FrntEnd SPI Intrface RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| MCP3901T-I/SS | 功能描述:开关变换器、稳压器与控制器 Dual Ch Enrgy Metr FrntEnd SPI Intrface RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| MCP3903 | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:Six Channel Delta Sigma A/D Converter |
| MCP3903-E/SS | 功能描述:模数转换器 - ADC 6CH Energy Meter Fr End SPI Interface RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MCP3903-E/SS | 制造商:Microchip Technology Inc 功能描述:; Leaded Process Compatible:Yes; Peak Re |
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