参数资料
型号: MCP4262T-503E/MF
厂商: Microchip Technology
文件页数: 20/88页
文件大小: 0K
描述: IC POT DGTL DUAL 50K RHEO 10DFN
标准包装: 3,300
系列: WiperLock™
接片: 257
电阻(欧姆): 50k
电路数: 2
温度系数: 标准值 150 ppm/°C
存储器类型: 非易失
接口: 4 线 SPI(芯片选择)
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-VFDFN 裸露焊盘
供应商设备封装: 10-DFN-EP(3x3)
包装: 带卷 (TR)
2008 Microchip Technology Inc.
DS22059B-page 27
MCP414X/416X/424X/426X
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follows.
TABLE 3-1:
PINOUT DESCRIPTION FOR THE MCP414X/416X/424X/426X
Pin
Weak
Pull-up/
down
Standard Function
Single
Dual
Symbol
I/O
Buffer
Type
Rheo Pot (1) Rheo
Pot
8L
10L
14L
16L
1
111
16
CS
I
HV w/ST
“smart” SPI Chip Select Input
2
1
SCK
I
HV w/ST
“smart” SPI Clock Input
3
3
2
SDI
I
HV w/ST
“smart” SPI Serial Data Input
3
SDI/SDO
I/O
HV w/ST
“smart” SPI Serial Data Input/Output
4
444
3, 4
VSS
—P
Ground
5
P1B
A
Analog
No
Potentiometer 1 Terminal B
6
P1W
A
Analog
No
Potentiometer 1 Wiper Terminal
7
P1A
A
Analog
No
Potentiometer 1 Terminal A
5
8
P0A
A
Analog
No
Potentiometer 0 Terminal A
5
6
7
9
P0W
A
Analog
No
Potentiometer 0 Wiper Terminal
6
7
8
10
P0B
A
Analog
No
Potentiometer 0 Terminal B
——
11
12
WP
I
“smart” Hardware
EEPROM
Write
Protect
12
13
SHDN
I
HV w/ST
“smart” Hardware Shutdown
7
9
13
14
SDO
O
No
SPI Serial Data Out
8
10
14
15
VDD
—P
Positive Power Supply Input
———
11
NC
No Connection
99
11
17
EP
Exposed Pad. (Note 4)
Legend:
HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals)
I = digital input (high Z)
O = digital output
I/O = Input / Output
P = Power
Note 1:
The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin
(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been
requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.
2:
The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and shut-
down current.
3:
The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be
at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,
customers can increase the rate with external pull-up resistors.
4:
The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s VSS pin.
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