参数资料
型号: MCP6002T-I/SN
厂商: Microchip Technology
文件页数: 3/42页
文件大小: 0K
描述: IC OPAMP 1.8V 1MHZ DUAL 8-SOIC
标准包装: 3,300
放大器类型: 通用
电路数: 2
输出类型: 满摆幅
转换速率: 0.6 V/µs
增益带宽积: 1MHz
电流 - 输入偏压: 1pA
电压 - 输入偏移: 4500µV
电流 - 电源: 100µA
电流 - 输出 / 通道: 23mA
电压 - 电源,单路/双路(±): 1.8 V ~ 6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
2009 Microchip Technology Inc.
DS21733J-page 11
MCP6001/1R/1U/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The
non-inverting
and
inverting
inputs
are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 1.8V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP6001 MCP6001R MCP6001U
MCP6002
MCP6004
Symbol
Description
SC70-5,
SOT-23-5
MSOP,
PDIP,
SOIC
DFN
2x3
PDIP,
SOIC,
TSSOP
11
4
1
VOUT, VOUTA Analog Output (op amp A)
44
3
2
VIN–, VINA– Inverting Input (op amp A)
33
1
3
VIN+, VINA+ Non-inverting Input (op amp A)
52
5
8
4
VDD
Positive Power Supply
——
5
VINB+
Non-inverting Input (op amp B)
——
6
VINB
Inverting Input (op amp B)
——
7
VOUTB
Analog Output (op amp B)
——
8
VOUTC
Analog Output (op amp C)
——
9
VINC
Inverting Input (op amp C)
——
10
VINC+
Non-inverting Input (op amp C)
25
2
4
11
VSS
Negative Power Supply
——
12
VIND+
Non-inverting Input (op amp D)
——
13
VIND
Inverting Input (op amp D)
——
14
VOUTD
Analog Output (op amp D)
9
EP
Exposed Thermal Pad (EP);
must be connected to VSS.
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