参数资料
型号: MCP601-E/P
厂商: Microchip Technology
文件页数: 29/34页
文件大小: 0K
描述: IC OPAMP CMOS SGL 2.7V 8-DIP
标准包装: 60
放大器类型: 通用
电路数: 1
输出类型: 满摆幅
转换速率: 2.3 V/µs
增益带宽积: 2.8MHz
电流 - 输入偏压: 1pA
电压 - 输入偏移: 700µV
电流 - 电源: 230µA
电流 - 输出 / 通道: 22mA
电压 - 电源,单路/双路(±): 2.7 V ~ 6 V
工作温度: -40°C ~ 125°C
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-PDIP
包装: 管件
产品目录页面: 678 (CN2011-ZH PDF)
MCP601/1R/2/3/4
DS21314G-page 4
2007 Microchip Technology Inc.
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-2. The bypass
capacitors are laid out according to the rules discussed
in
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
DD = +2.7V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
+85
°C
Industrial temperature parts
TA
-40
+125
°C
Extended temperature parts
Operating Temperature Range
TA
-40
+125
°C
Storage Temperature Range
TA
-65
+150
°C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23
θ
JA
—256
°C/W
Thermal Resistance, 6L-SOT23
θ
JA
—230
°C/W
Thermal Resistance, 8L-PDIP
θ
JA
—85
°C/W
Thermal Resistance, 8L-SOIC
θ
JA
—163
°C/W
Thermal Resistance, 8L-TSSOP
θ
JA
—124
°C/W
Thermal Resistance, 14L-PDIP
θ
JA
—70
°C/W
Thermal Resistance, 14L-SOIC
θ
JA
—120
°C/W
Thermal Resistance, 14L-TSSOP
θ
JA
—100
°C/W
Note:
The Industrial temperature parts operate over this extended range, but with reduced performance. The
Extended temperature specs do not apply to Industrial temperature parts. In any case, the internal Junction
temperature (TJ) must not exceed the absolute maximum specification of 150°C.
VDD
MCP60X
RG
RF
RN
VOUT
VIN
VDD/2
1F
CL
RL
VL
0.1 F
VDD
MCP60X
RG
RF
RN
VOUT
VDD/2
VIN
1F
CL
RL
VL
0.1 F
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