参数资料
型号: MCP604T-E/ST
元件分类: 运算放大器
英文描述: QUAD OP-AMP, 4500 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO14
封装: 4.40 MM, PLASTIC, MO-153, TSSOP-14
文件页数: 15/28页
文件大小: 601K
代理商: MCP604T-E/ST
MCP601/2/3/4
DS21314F-page 22
2004 Microchip Technology Inc.
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
n
D
1
2
eB
β
E
c
A
A1
B
B1
L
A2
p
α
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
14
Pitch
p
.100
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.740
.750
.760
18.80
19.05
19.30
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
§
eB
.310
.370
.430
7.87
9.40
10.92
Mold Draft Angle Top
α
5
10
15
5
10
15
β
5
10
15
5
10
15
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
§ Significant Characteristic
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