参数资料
型号: MCP9510CT-E/CH
厂商: Microchip Technology
文件页数: 16/28页
文件大小: 0K
描述: IC TEMP SWITCH OD 125C SOT23-6
标准包装: 1
感应温度: -40°C ~ 125°C
输出类型: 高态有效,低态/推挽式,开漏极
电源电压: 2.7 V ~ 5.5 V
精确度: ±0.5°C
封装/外壳: SOT-23-6
供应商设备封装: SOT-23-6
包装: 标准包装
产品目录页面: 682 (CN2011-ZH PDF)
其它名称: MCP9510CT-E/CHDKR
MCP9509/10
4.6
Application Information
The MCP9509/10 temperature switch integrates a
temperature sensor and a comparator circuit which out-
puts an alert signal when the user programmed tem-
perature threshold is exceeded. The external resistor
value to set the output threshold can be determined
HYST
5V DD
MCP9510 OUT
using Table 4-2 . A constant current source I SET = 5 μA
(typical) biases the external resistor R SET . A thermal
diode is used to measure ambient temperature. When
the voltage across the thermal diode exceeds the volt-
R SET
SET
OUTSET
I/O
5V DD
age across R SET , V SET , the sensor output asserts. The
Micro-
sensor output de-asserts when the diode voltage drops
below V SET and the user selected hysteresis level.
HYST
5V DD
controller
The MCP9509/10 provide Open-drain output where
multiple sensors from multiple PCB hot-spots can be
connected to a single processor I/O input with a
wired-Or Configuration. The MCP9509 requires an
external pull-up resistor which can be used to level-shift
the alert signal. For example, if the sensors are
powered with 5V DD and the controller or processor is
powered with 3V DD , the external resistor can be
level-shifted by connecting 3V DD to the pull-up resistor
as shown in Figure 4-5 . The MCP9510 elliminates the
need for an external resistor while providing wired-Or
function ( Figure 4-6 ). The MCP9510 also provides
MCP9510 OUT
SET
R SET
OUTSET
FIGURE 4-6: MCP9510 Wired-Or Output
Configuration with Internal Pull-up Resistor.
push-pull output configuration for a direct connection to
the processor with Active-Low or Active-High assert
polarities.
4.6.1
LAYOUT CONSIDERATION AND
THERMAL CONSIDERATION
This family of sensors measure temperature by moni-
toring the voltage level of a thermal diode located in the
HYST
5V DD
die. A low-impedance thermal path between the die
and the PCB is provided by the pins. Therefore, the
MCP9509 OUT
3V DD
sensor effectively monitors PCB temperature. For
efficient performance, it is recommended to layout the
R SET
SET
R PULL_UP
3V DD
device as close to the heat source as possible. It is also
recommended to use a de-coupling capacitor of 0.1 μF
to 1 μF between V DD and GND pins for stability.
When connecting an external resistor to the MCP9509
device, the current through the pull-up resistor must be
I/O
considered to prevent self-heat due to power. This can
HYST
SET
R SET
5V DD
MCP9509 OUT
Micro-
controller
be determined using Equation 4-3 .
EQUATION 4-3:
EFFECT OF
SELF-HEATING
T J – T A = θ JA ( V DD × I DD + V OL × I OUT )
Where:
T J
=
Junction Temperature
T A
=
Ambient Temperature
FIGURE 4-5: MCP9509 Wired-Or Output
Configuration with Level-shift.
DS22114A-page 16
θ JA
V OL
I OUT
=
=
=
Package Thermal Resistance
(220.7 °C/W)
Sensor Output Low Voltage
Output Current
? 2008 Microchip Technology Inc.
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