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型号： MCZ33903BS5EK
厂商： Freescale Semiconductor
文件页数： 17/106页
文件大小： 0K
描述： IC SBC CAN HS 5.0V 32SOIC
标准包装： 42
应用： 系统基础芯片
接口： CAN，LIN
电源电压： 5.5 V ~ 28 V
封装/外壳： 32-SSOP（0.295"，7.50mm 宽）裸露焊盘
供应商设备封装： 32-SOICW 裸露焊盘
包装： 管件
安装类型： 表面贴装
Analog Integrated Circuit Device Data
18
Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Figure 13. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)
ESD Capability
AECQ100(11)
Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 )
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
all other Pins including CANH and CANL
Charge Device Model - JESD22/C101 (CZAP = 4.0 pF
Corner Pins (Pins 1, 16, 17, and 32)
All other Pins (Pins 2-15, 18-31)
Tested per IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 )
Device unpowered, CANH and CANL pin without capacitor, versus GND
Device unpowered, LIN, LIN1 and LIN2 pin, versus GND
Device unpowered, VS1/VS2 (100 nF to GND), versus GND
Tested per specific OEM EMC requirements for CAN and LIN with
additional capacitor on VSUP/1/2 pins (See Typical Applications on page
91)
CANH, CANL without bus filter
LIN, LIN1 and LIN2 with and without bus filter
I/O with external components (22 k - 10 nF)
VESD1-1
VESD1-2
VESD2-1
VESD2-2
VESD3-1
VESD3-2
VESD3-3
VESD4-1
VESD4-2
VESD4-3
8000
2000
750
500
15000
9000
12000
7000
V
THERMAL RATINGS
Junction temperature
TJ
150
°C
Ambient temperature
TA
-40 to 125
°C
Storage temperature
TST
-50 to 150
°C
THERMAL RESISTANCE
Thermal resistance junction to ambient(14)
RJA
50(14)
°C/W
Peak package reflow temperature during reflow(12), (13)
TPPRT
Note 13
°C
Notes
11.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500 ), the Charge Device Model
(CDM), and Robotic (CZAP = 4.0 pF).
12.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
13.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
14.
This parameter was measured according to Figure 13:
Table 5. Maximum Ratings (continued)
All voltages are referenced to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit
PCB 100mm x 100mm
Bottom side
20mm x 40mm
Top side, 300 sq. mm
(20mmx15mm)
Bottom view
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相关代理商/技术参数
参数描述
MCZ33903BS5EKR2 功能描述:CAN 接口集成电路 SBC W/HIGH SPEED CAN 5V RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube
MCZ33903BS5R2 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:SBC Gen2 with CAN High Speed and LIN Interface
MCZ33903C3EK 功能描述:CAN 接口集成电路 SBC W/HIGH SPEED CAN 3V RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube
MCZ33903C3EKR2 制造商:Freescale Semiconductor 功能描述:SYSTEM BASIS CHIP GEN2 WITH HIGH SPEED CAN AND LIN INTERFACE 制造商:Freescale Semiconductor 功能描述:3.3V REGULATOR + CAN - Tape and Reel 制造商:Freescale Semiconductor 功能描述:IC SBC CAN HS 3.3V 32SOIC 制造商:Freescale Semiconductor 功能描述:SBC W/HIGH SPEED CAN 3V
MCZ33903C5EK 功能描述:CAN 接口集成电路 SBC W/HIGH SPEED CAN 5V RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube
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