参数资料
型号: MGSF1N03LT1
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET N-CH 30V 1.6A SOT-23
产品变化通告: Product Obsolescence 21/Jan/2010
标准包装: 10
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 1.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 100 毫欧 @ 1.2A,10V
Id 时的 Vgs(th)(最大): 2.4V @ 250µA
输入电容 (Ciss) @ Vds: 140pF @ 5V
功率 - 最大: 420mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3(TO-236)
包装: 剪切带 (CT)
其它名称: MGSF1N03LT1OSCT
MGSF1N03L, MVGSF1N03L
Power MOSFET
30 V, 2.1 A, Single N ? Channel, SOT ? 23
These miniature surface mount MOSFETs low R DS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are dc ? dc converters and power management in portable
and battery ? powered products such as computers, printers, PCMCIA
http://onsemi.com
cards, cellular and cordless telephones.
Features
? Low R DS(on) Provides Higher Efficiency and Extends Battery Life
? Miniature SOT ? 23 Surface Mount Package Saves Board Space
? AEC ? Q101 Qualified and PPAP Capable ? MVGSF1N03LT1
? These Devices are Pb ? Free and are RoHS Compliant
V (BR)DSS
30 V
R DS(on) TYP
80 m W @ 10 V
125 m W @ 4.5 V
N ? Channel
D
I D MAX
2.1 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
± 20
V
V
G
Continuous Drain
Current R q JL
Power Dissipation
R q JL
Continuous Drain
Current (Note 1)
Steady
State
Steady
State
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
I D
P D
I D
2.1
1.5
0.69
1.6
1.2
A
W
A
S
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
Power Dissipation
(Note 1)
Pulsed Drain Current
ESD Capability
(Note 3)
T A = 25 ° C
t p = 10 m s
C = 100 pF,
RS = 1500 W
P D
I DM
ESD
0.42
6.0
125
W
A
V
1
SOT ? 23
CASE 318
STYLE 21
N3 M G
G
1 2
Gate Source
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J , T STG
I S
? 55 to 150
2.1
° C
A
N3
M
G
= Specific Device Code
= Date Code*
= Pb ? Free Package
Lead Temperature for Soldering Purposes
(1/8” from case for 10 sec)
THERMAL RESISTANCE RATINGS
Parameter
T L
Symbol
260
Max
° C
Unit
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Junction ? to ? Foot ? Steady State
Junction ? to ? Ambient ? Steady State (Note 1)
Junction ? to ? Ambient ? t < 10 s (Note 1)
R q JL
R q JA
R q JA
180
300
250
° C/W
Device
MGSF1N03LT1G
Package
SOT ? 23
Pb ? Free
Shipping ?
3000 / Tape &
Reel
Junction ? to ? Ambient ? Steady State (Note 2) R q JA 400
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 650 mm 2 , 1 oz. Cu pad size.
2. Surface ? mounted on FR4 board using 50 mm 2 , 1 oz. Cu pad size.
3. ESD Rating Information: HBM Class 0.
MGSF1N03LT3G SOT ? 23 10000 / Tape &
(Pb ? Free) Reel
MVGSF1N03LT1G SOT ? 23 3000 / Tape &
(Pb ? Free) Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
September, 2012 ? Rev. 10
1
Publication Order Number:
MGSF1N03LT1/D
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