参数资料
型号: MIC49150-1.8BR TR
厂商: Micrel Inc
文件页数: 10/13页
文件大小: 0K
描述: IC REG LDO 1.8V 1.5A SPAK-5
标准包装: 750
稳压器拓扑结构: 正,固定式
输出电压: 1.8V
输入电压: 最高 6.5V
电压 - 压降(标准): 0.28V @ 1.5A
稳压器数量: 1
电流 - 输出: 1.5A
电流 - 限制(最小): 1.6A
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SPAK-5
供应商设备封装: S-PAK-5
包装: 带卷 (TR)
其它名称: MIC49150-1.8BRTR
MIC49150-1.8BRTR-ND
Micrel, Inc.
capacitor of at least 1μF is needed directly between the
input and regulator ground. Refer to “ Application Note 9 ”
for further details and examples on thermal design and
heat sink speci ? cation.
Minimum Load Current
MSOP-8
MIC49150
The MIC49150, unlike most
other high current
regulators, does not require a minimum load to maintain
output voltage regulation.
Power MSOP-8 Thermal Characteristics
q JA
One of the secrets of the MIC49150’s performance is its
power MSOP-8 package featuring half the thermal
resistance of a standard MSOP-8 package. Lower
thermal resistance means more output current or higher
q JC
q CA
AMBIENT
ground plane
heat sink area
input voltage for a given package size.
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a
single-piece electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
Thermal resistance consists of two main elements, θ JC
(junction-to-case thermal resistance) and θ CA (case-to-
ambient thermal resistance). See Figure 1. θ JC is the
resistance from the die to the leads of the package. θ CA
is the resistance from the leads to the ambient air and it
includes θ CS (case-to-sink thermal resistance) and θ SA
(sink-to-ambient thermal resistance).
Using the power MSOP-8 reduces the θ JC dramatically
and allows the user to reduce θ CA . The total thermal
resistance, θ JA (junction-to-ambient thermal resistance)
is the limiting factor in calculating the maximum power
dissipation capability of the device. Typically, the power
MSOP-8 has a θ JA of 80°C/W, this is signi ? cantly lower
than the standard MSOP-8 which is typically 160°C/W.
printed circuit board
Figure 1. Thermal Resistance
Figure 2 shows copper area versus power dissipation
with each trace corresponding to a different temperature
rise above ambient.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
900
800
700
600
500
400
300
200
100
θ CA is reduced because pins 5 through 8 can now be
soldered directly to a ground plane which signi ? cantly
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
reduces the case-to-sink thermal resistance and sink to
ambient thermal resistance.
Figure 2. Copper Area vs. Power-MSOP
Power Dissipation ( ? T JA )
Low-dropout linear regulators from Micrel are rated to a
maximum junction temperature of 125°C. It is important
not to exceed this maximum junction temperature during
operation of the device. To prevent this maximum
junction temperature from being exceeded, the
appropriate ground plane heat sink must be used.
900
800
700
600
500
400
TJ = 125°C
85°C
50°C 25°C
300
200
100
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 3. Copper Area vs. Power-MSOP
Power Dissipation (T A )
November 2006
10
M9999-111306
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