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| 型号： | MICRF002YM |
| 厂商： | Micrel Inc |
| 文件页数： | 13/17页 |
| 文件大小： | 0K |
| 描述： | IC ASK RCVR RF/IF SHUTDWN 16SOIC |
| 标准包装： | 48 |
| 系列： | QwikRadio® |
| 频率： | 300MHz ~ 440MHz |
| 灵敏度： | -95dBm |
| 数据传输率 - 最大： | 10 kbps |
| 调制或协议： | ASK，OOK |
| 应用： | RKE |
| 电流 - 接收： | 2.2mA |
| 数据接口： | PCB，表面贴装 |
| 天线连接器： | PCB，表面贴装 |
| 特点： | 自动调谐 |
| 电源电压： | 4.75 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 571 (CN2011-ZH PDF) |
| 其它名称： | 576-1332 |
Micrel, Inc.
C AGC Pin
VDDBB
MICRF002/RF022
driver is recommended for driving high-capacitance loads.
REFOSC Pin
Compa-
rator
1.5μA
67.5μA
REFOSC
30pF
Active
Bias
200k
250
VDDBB
CAGC
30pF
30μA
Timout
15μA
675μA
VSSBB
VSSBB
Figure 5. REFOSC Pin
VSSBB
Figure 3. CAGC Pin
Figure 3 illustrates the C AGC pin interface circuit. The AGC
control voltage is developed as an integrated current into a
capacitor C AGC . The attack current is nominally 15 μ A, while
the decay current is a 1/10th scaling of this, nominally
1.5 μ A, making the attack/decay time constant ratio a fixed
10:1. Signal gain of the RF/IF strip inside the IC diminishes
as the voltage at C AGC decreases. Modification of the
attack/decay ratio is possible by adding resistance from the
C AGC pin to either V DDBB or V SSBB , as desired.
The REFOSC input circuit is shown in Figure 5. Input
impedance is high (200k ? ). This is a Colpitts oscillator with
internal 30pF capacitors. This input is intended to work with
standard ceramic resonators connected from this pin to the
V SSBB pin, although a crystal may be used when greater
frequency accuracy is required. The nominal dc bias
voltage on this pin is 1.4V.
SEL0, SEL1, SWEN, and SHUT Pins
VDDBB
Q1
Both the push and pull current sources are disabled during
shutdown, which maintains the voltage across C AGC , and
improves recovery time in duty-cycled applications. To
further improve duty-cycle recovery, both push and pull
currents are increased by 45 times for approximately 10ms
after release of the SHUT pin. This allows rapid recovery of
any voltage droop on C AGC while in shutdown.
VSSBB
SHUT
SEL0,
SEL1,
SWEN
Q4
Q2
to Internal
Circuits
Q3
VSSBB
DO and WAKEB Pins
VDDBB
10μA
Figure 6a. SEL0, SEL1, SWEN Pins
VDDBB
Compa-
rator
DO
VSSBB
SHUT
Q1
Q2
Q3
to Internal
Circuits
VSSBB
10μA
Figure 6b. SHUT Pin
VSSBB
Figure 4. DO and WAKEB Pins
The output stage for DO (digital output) and WAKEB
(wakeup output) is shown in Figure 4. The output is a 10 μ A
push and 10 μ A pull switched-current stage. This output
stage is capable of driving CMOS loads. An external buffer-
Control input circuitry is shown in Figures 6a and 6b. The
standard input is a logic inverter constructed with minimum
geometry MOSFETs (Q2, Q3). P-channel MOSFET Q1 is
a large channel length device which functions essentially
as a “weak” pullup to V DDBB . Typical pull-up current is 5 μ A,
leading to an impedance to the V DDBB supply of typically
1M ? .
July 2008
13
M9999-070808
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