参数资料
型号: MK30DN512ZVLQ10R
厂商: Freescale Semiconductor
文件页数: 13/74页
文件大小: 0K
描述: IC ARM CORTEX MCU 512KB 144LQFP
标准包装: 500
系列: Kinetis
核心处理器: ARM? Cortex?-M4
芯体尺寸: 32-位
速度: 100MHz
连通性: CAN,EBI/EMI,I²C,IrDA,SDHC,SPI,UART/USART
外围设备: DMA,I²S,LCD,LVD,POR,PWM,WDT
输入/输出数: 102
程序存储器容量: 512KB(512K x 8)
程序存储器类型: 闪存
RAM 容量: 128K x 8
电压 - 电源 (Vcc/Vdd): 1.71 V ~ 3.6 V
数据转换器: A/D 37x16b,D/A 2x12b
振荡器型: 内部
工作温度: -40°C ~ 105°C
封装/外壳: 144-LQFP
包装: *
2. VDD = 3.3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz, fBUS = 48MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
7
pF
CIN_D
Input capacitance: digital pins
7
pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYS
System and core clock
100
MHz
fBUS
Bus clock
50
MHz
FB_CLK
FlexBus clock
50
MHz
fFLASH
Flash clock
25
MHz
fLPTMR
LPTMR clock
25
MHz
5.3.2 General switching specifications
These general purpose specifications apply to all signals configured for GPIO, UART,
CAN, CMT, and I2C signals.
General
K30 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
20
Freescale Semiconductor, Inc.
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