参数资料
型号: MK30DX256ZVLQ10
厂商: Freescale Semiconductor
文件页数: 7/74页
文件大小: 0K
描述: IC ARM CORTEX MCU 256KB 144LQFP
标准包装: 300
系列: Kinetis
核心处理器: ARM? Cortex?-M4
芯体尺寸: 32-位
速度: 100MHz
连通性: CAN,EBI/EMI,I²C,IrDA,SDHC,SPI,UART/USART
外围设备: DMA,I²S,LCD,LVD,POR,PWM,WDT
输入/输出数: 102
程序存储器容量: 256KB(256K x 8)
程序存储器类型: 闪存
RAM 容量: 64K x 8
电压 - 电源 (Vcc/Vdd): 1.71 V ~ 3.6 V
数据转换器: A/D 37x16b,D/A 2x12b
振荡器型: 内部
工作温度: -40°C ~ 105°C
封装/外壳: 144-LQFP
包装: 托盘
Table 4. Voltage and current operating behaviors (continued)
Symbol
Description
Min.
Typ.1
Max.
Unit
Notes
IIND
Input leakage current, digital pins
VDD < VIN < 5.5 V
1
50
μA
4, 5
ZIND
Input impedance examples, digital pins
VDD = 3.6 V
VDD = 3.0 V
VDD = 2.5 V
VDD = 1.7 V
48
55
57
85
4, 7
RPU
Internal pullup resistors
20
35
50
RPD
Internal pulldown resistors
20
35
50
1. Typical values characterized at 25°C and VDD = 3.6 V unless otherwise noted.
2. Open drain outputs must be pulled to VDD.
3. Analog pins are defined as pins that do not have an associated general purpose I/O port function.
4. Digital pins have an associated GPIO port function and have 5V tolerant inputs, except EXTAL and XTAL.
5. Internal pull-up/pull-down resistors disabled.
6. Characterized, not tested in production.
7. Examples calculated using VIL relation, VDD, and max IIND: ZIND=VIL/IIND. This is the impedance needed to pull a high
signal to a level below VIL due to leakage when VIL < VIN < VDD. These examples assume signal source low = 0 V.
8. Measured at VDD supply voltage = VDD min and Vinput = VSS
9. Measured at VDD supply voltage = VDD min and Vinput = VDD
+
Digital input
Source
Z IND
I IND
5.2.4 Power mode transition operating behaviors
All specifications except tPOR, and VLLSx→RUN recovery times in the following table
assume this clock configuration:
CPU and system clocks = 100 MHz
Bus clock = 50 MHz
FlexBus clock = 50 MHz
Flash clock = 25 MHz
MCG mode: FEI
General
K30 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Freescale Semiconductor, Inc.
15
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