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| 型号： | MK50X256CMB100R |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA81 |
| 封装： | 8 X 8 MM, MAPBGA-81 |
| 文件页数： | 13/72页 |
| 文件大小： | 1836K |
| 代理商： | MK50X256CMB100R |
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4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
85
°C
5.3.2 Thermal attributes
Board
type
Symbol
Description
81
MAPBGA
80 LQFP Unit
Notes
Single-
layer (1s)
RθJA
Thermal resistance, junction to ambient (natural
convection)
TBD
°C/W
Four-layer
(2s2p)
RθJA
Thermal resistance, junction to ambient (natural
convection)
TBD
°C/W
Single-
layer (1s)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
TBD
°C/W
Four-layer
(2s2p)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
TBD
°C/W
—
RθJB
Thermal resistance, junction to board
TBD
°C/W
—
RθJC
Thermal resistance, junction to case
TBD
°C/W
—
ΨJT
Thermal characterization parameter, junction to
package top outside center (natural convection)
TBD
°C/W
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
1. output pins
have CL=30pF loads,
are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
are configured for high drive strength (PORTx_PCRn[DSE]=1)
Peripheral operating requirements and behaviors
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
20
Preliminary
Freescale Semiconductor, Inc.
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