参数资料
型号: MK53DX256ZCMD10
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144
封装: 13 X 13 MM, MAPBGA-144
文件页数: 30/82页
文件大小: 1124K
代理商: MK53DX256ZCMD10
Table 21. Flash command timing specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
teewr16b32k
teewr16b64k
teewr16b128k
teewr16b256k
Word-write to FlexRAM execution time:
32 KB EEPROM backup
64 KB EEPROM backup
128 KB EEPROM backup
256 KB EEPROM backup
TBD
1.5
TBD
2.5
ms
Longword-write to FlexRAM for EEPROM operation
teewr32bers Longword-write to erased FlexRAM location
execution time
200
TBD
μs
teewr32b32k
teewr32b64k
teewr32b128k
teewr32b256k
Longword-write to FlexRAM execution time:
32 KB EEPROM backup
64 KB EEPROM backup
128 KB EEPROM backup
256 KB EEPROM backup
TBD
2.7
TBD
3.7
ms
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased.
6.4.1.3 Flash (FTFL) current and power specfications
Table 22. Flash (FTFL) current and power specfications
Symbol
Description
Typ.
Unit
IDD_PGM
Worst case programming current in program flash
10
mA
6.4.1.4 Reliability specifications
Table 23. NVM reliability specifications
Symbol
Description
Min.
Typ.1
Max.
Unit
Notes
Program Flash
tnvmretp10k Data retention after up to 10 K cycles
5
TBD
years
tnvmretp1k Data retention after up to 1 K cycles
10
TBD
years
tnvmretp100 Data retention after up to 100 cycles
15
TBD
years
nnvmcycp
Cycling endurance
10 K
TBD
cycles
Data Flash
tnvmretd10k Data retention after up to 10 K cycles
5
TBD
years
tnvmretd1k Data retention after up to 1 K cycles
10
TBD
years
tnvmretd100 Data retention after up to 100 cycles
15
TBD
years
Table continues on the next page...
Peripheral operating requirements and behaviors
K53 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
36
Preliminary
Freescale Semiconductor, Inc.
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