参数资料
型号: MLF1005LR33K
厂商: TDK Corporation
文件页数: 5/10页
文件大小: 0K
描述: INDUCTOR MULTILAYER .33UH 0402
产品目录绘图: 1005 (0402) Top
1005 (0402) Side
其它图纸: 1005 (0402) Footprint
标准包装: 1
系列: MLF
电感: 330nH
电流: 90mA
容差: ±10%
屏蔽: 屏蔽
DC 电阻(DCR): 最大 1.05 欧姆
Q因子@频率: 10 @ 25MHz
频率 - 自谐振: 230MHz
封装/外壳: 0402(1005 公制)
安装类型: 表面贴装
包装: 标准包装
工作温度: -40°C ~ 85°C
频率 - 测试: 25MHz
其它名称: 445-6213-6
(4/9)
Inductors for Standard Circuits
Multilayer/STD ? Magnetic Shielded
MLF Series MLF1608
Conformity to RoHS Directive
FEATURES
? High-reliability monolithic structure.
PRODUCT IDENTIFICATION
MLF 1608 A 1R0 K T
? Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
? Excellent solderability and high heat resistance permits either
flow or reflow soldering.
? The products contain no lead and also support lead-free
soldering.
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L × W
1608
(7)
1.6 × 0.8mm
? It is a product conforming to RoHS directive.
(3) Type name
APPLICATIONS
Digital cellular phone, tuner, personal computers, audio, or various
(4) Inductance
electronic appliances
SPECIFICATIONS
Operating temperature range
–40 to +85°C
47N
R15
1R0
47nH[0.047 μ H]
0.15 μ H
1 μ H
Storage temperature range
–40 to +85°C(After mount)
(5) Tolerance
K
±10%
RECOMMENDED SOLDERING CONDITION
M
±20%
REFLOW SOLDERING
(6) Packaging style
10s max.
T
Taping [reel]
250 to 260?C
230?C
Natural
cooling
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
180?C
150?C
Packaging style
Taping
Quantity
4000 pieces/reel
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
? Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
? After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
? The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
? Do not expose the inductors to stray magnetic fields.
? Avoid static electricity discharge during handling.
? When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
? Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
? Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
? All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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MLF1005LR33KT 制造商:TDK 功能描述:Ind RF Chip Shielded Multi-Layer 330nH 10% 25MHz 10Q-Factor 90mA 0402 T/R
MLF1005LR39K 功能描述:固定电感器 0.39uH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
MLF1005LR39KT 制造商:TDK 功能描述:Ind RF Chip Shielded Multi-Layer 390nH 10% 10MHz 25Q-Factor 50mA 0402 T/R
MLF1005LR47K 功能描述:固定电感器 0.47uH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
MLF1005LR47KT 制造商:TDK 功能描述:Ind RF Chip Shielded Multi-Layer 470nH 10% 10MHz 25Q-Factor 50mA 0402 T/R