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| 型号： | MM908E624ACEWR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 29/39页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH TRPL HI MCU/LIN 54SOIC |
| 标准包装： | 1 |
| 应用： | 自动镜像控制 |
| 核心处理器： | HC08 |
| 程序存储器类型： | 闪存（16 kB） |
| 控制器系列： | 908E |
| RAM 容量： | 512 x 8 |
| 接口： | SCI，SPI |
| 输入/输出数： | 16 |
| 电源电压： | 5.5 V ~ 18 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 54-BSSOP（0.295"，7.50mm 宽） |
| 包装： | 标准包装 |
| 供应商设备封装： | 54-SOIC |
| 配用： | KIT908E624DWBEVB-ND - KIT EVAL 908E624 TRPL W/MCU/LIN |
| 其它名称： | MM908E624ACEWR2DKR |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
35
908E624
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
INTRODUCTION
This thermal addendum is provided as a supplement to the MM908E624
technical datasheet. The addendum provides thermal performance information
that may be critical in the design and development of system applications. All
electrical, application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MM908E624 is a dual die package. There are two heat sources in the
package independently heating with P1 and P2. This results in two junction
temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn.
For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the reference
temperature while only heat source 1 is heating with P1.
For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the
reference temperature while heat source 2 is heating with P2. This applies to
RθJ21 and RθJ22, respectively.
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a
package in an application-specific environment. Stated values were obtained by measurement and simulation according to the
standards listed below
Standards
54-Pin
SOICW
908E624
EW (Pb-FREE) SUFFIX
98ASA99294D
54-Pin SOICW
Note
For package dimensions, refer to
98ASA99294D.
TJ1
TJ2
=
RθJA11
RθJA21
RθJA12
RθJA22
.
P1
P2
Table 16. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip [
°C/W]
m = 1,
n = 1
m = 1, n = 2
m = 2, n = 1
m = 2,
n = 2
RθJAmn
40
31
36
RθJBmn
25
16
21
RθJAmn
57
47
52
RθJCmn
21
12
16
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
4.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.
Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
54 Terminal SOIC
0.65 mm Pitch
17.9 mm x 7.5 mm Body
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MM908E624ACPEW | 功能描述:8位微控制器 -MCU 3 HIGH SIDE SWITCH RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MM908E624ACPEWR2 | 功能描述:8位微控制器 -MCU 3 HIGH SIDE DRIVER RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MM908E624AYEW | 功能描述:开关 IC - 各种 TRIPLE HIGH SIDE SWITCH RoHS:否 制造商:Fairchild Semiconductor 开启电阻（最大值）: 电源电压-最大:4.4 V 电源电压-最小:2.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:WLCSP-9 封装:Reel |
| MM908E624AYEW/R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Triple High Side Switch with Embedded MCU and LIN Serial Communicationfor Relay Drivers |
| MM908E624AYEWR2 | 功能描述:开关 IC - 各种 TRIPLE HIGH SIDE SWITCH RoHS:否 制造商:Fairchild Semiconductor 开启电阻（最大值）: 电源电压-最大:4.4 V 电源电压-最小:2.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:WLCSP-9 封装:Reel |
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