参数资料
型号: MMBF0201NLT1G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET N-CH 20V 300MA SOT-23
产品变化通告: Wire Change for SOT23 Pkg 26/May/2009
产品目录绘图: MOSFET SOT-23-3 Pkg
标准包装: 10
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 300mA
开态Rds(最大)@ Id, Vgs @ 25° C: 1 欧姆 @ 300mA,10V
Id 时的 Vgs(th)(最大): 2.4V @ 250µA
输入电容 (Ciss) @ Vds: 45pF @ 5V
功率 - 最大: 225mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3(TO-236)
包装: 标准包装
产品目录页面: 1558 (CN2011-ZH PDF)
其它名称: MMBF0201NLT1GOSDKR
MMBF0201NL,
MVMBF0201NL
Power MOSFET
300 mAmps, 20 Volts
N ? Channel SOT ? 23
These miniature surface mount MOSFETs low R DS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in small power management circuitry. Typical applications are
d c ? d c c o n v e r t e r s , p o w e r m a n a g e m e n t i n p o r t a b l e a n d
battery ? powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
Features
? Low R DS(on) Provides Higher Efficiency and Extends Battery Life
? Miniature SOT ? 23 Surface Mount Package Saves Board Space
? MVMBF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC ? Q101
http://onsemi.com
300 mAMPS ? 20 VOLTS
R DS(on) = 1 W
N ? Channel
3
1
?
Qualified and PPAP Capable*
These Devices are Pb ? Free and are RoHS Compliant
2
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating Symbol Value
Unit
MARKING DIAGRAM
AND PIN ASSIGNMENT
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Drain Current
? Continuous @ T A = 25 ° C
? Continuous @ T A = 70 ° C
? Pulsed Drain Current (t p ≤ 10 m s)
Total Power Dissipation @ T A = 25 ° C
V DSS
V GS
I D
I D
I DM
P D
20
± 20
300
240
750
225
Vdc
Vdc
mAdc
mW
1
2
3
SOT ? 23
CASE 318
STYLE 21
3
Drain
N1 M G
G
1 2
Gate Source
Operating and Storage Temperature Range
T J , T stg
? 55 to 150
° C
Thermal Resistance, Junction ? to ? Ambient
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
R q JA
T L
556
260
° C/W
° C
N1
M
G
= Specific Device Code
= Date Code*
= Pb ? Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
MMBF0201NLT1G
MVMBF0201NLT1G*
Package
SOT ? 23
(Pb ? Free)
SOT ? 23
(Pb ? Free)
Shipping ?
3000 / Tape &
Reel
3000 / Tape &
Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2013
August, 2013 ? Rev. 5
1
Publication Order Number:
MMBF0201NLT1/D
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