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参数资料
| 型号： | MPC107APX100L0 |
| 厂商： | MOTOROLA INC |
| 元件分类： | 外设及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PPGA503 |
| 封装： | PLASTIC, BGA-503 |
| 文件页数： | 43/46页 |
| 文件大小： | 585K |
| 代理商： | MPC107APX100L0 |
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6
MPC107 Hardware Specifications (Rev 0.2)
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
General Parameters
1.3 General Parameters
The following list provides a summary of the general parameters of the MPC107:
Technology:
0.35 m CMOS, ve-layer metal
Die size:
50 mm2
Transistor count:
0.96 million
Logic design:
Fully-static
Package:
Surface mount 503 Plastic Ball Grid Array (C4/PBGA)
Core power supply:
2.5V ± 5% V DC (nominal; see Table 2 for recommended operating
conditions)
I/O power supply:
3.0 to 3.6 V DC
1.4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specications and thermal characteristics for the MPC107.
1.4.1 DC Electrical Characteristics
1.4.1.1 Absolute Maximum Ratings
The tables in this section describe the MPC107 DC electrical characteristics. Table 1 provides the absolute
maximum ratings.
Table 1. Absolute Maximum Ratings
Characteristic1
Symbol
Range
Unit
Supply Voltage - Core
Vdd
-0.3 to 2.75
V
Supply Voltage - Memory Bus Drivers
GVdd
-0.3 to 3.6
V
Supply Voltage - Processor Bus Drivers
BVdd
-0.3 to 3.6
V
Supply Voltage - PCI and Standard I/O Buffers
OVdd
-0.3 to 3.6
V
Supply Voltage - PLLs and DLL
AVdd/LAVdd
-0.3 to 2.75
V
Supply Voltage - PCI Reference
LVdd
-0.3 to 5.4
V
Input Voltage2
VIN
-0.3 to 3.6
V
Operational Die-Junction Temperature Range
TJ
0 to 105
C
Storage Temperature Range
TSTG
-55 to 150
C
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress
ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may
affect device reliability or cause permanent damage to the device.
2. PCI inputs with LVdd = 5V ± 5% V DC may be correspondingly stressed at voltages exceeding LVdd + 0.5 V
DC.
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