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参数资料
| 型号： | MPC18730EP |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/35页 |
| 文件大小： | 0K |
| 描述： | IC PMIC PROGR 5-OUTPUTS 64-QFN |
| 产品变化通告： | MPC18730EP(R2) Discontinuation 04/Jun/2010 |
| 标准包装： | 260 |
| 应用： | 手持/移动设备 |
| 电流 - 电源： | 9mA |
| 电源电压： | 0.9 V ~ 4.2 V |
| 工作温度： | -10°C ~ 65°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-WFQFN |
| 供应商设备封装： | 64-QFN（9x9） |
| 包装： | 管件 |
| 配用： | KIT18730EPEVBE-ND - KIT FOR MPC18730 PMIC |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
V BATT
-0.5 to 5.0
V
Analog Signal Input
(1)
V INAN
-0.5 to VO1+0.5
V
Logic Signal Input
V
WAKE1~4B
CLEAR, SLEEP, EXT_CLOCK, SCKIN, DATA, STRB
VGATESEL1,2
Output Power Current
V ILRSTB
V ILGC
V ILGSEL
-0.5 to V_STDBY+0.5
-0.5 to VO1_SENSE+0.5
-0.5 to VBATT+0.5
mA
VOUT1 Power Supply Circuit
(2)
I OVO1
120
VOUT2 Power Supply Circuit
SREG1 Power Supply Circuit
SREG2 Power Supply Circuit
SREG3 Power Supply Circuit
VGATE Power Supply Circuit
PGOOD1 Power Supply Circuit
Open-Drain Output Apply Voltage
I OVO2
I OREG1
I OREG2
I OREG3
I OVG
I OPGOOD1
100
80
100
80
8
-20
V
PGOOD1
LSWO
ESD Voltage
V IODR
V IODV
-0.5 to 3.3
-0.5 to 3.3
V
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
THERMAL RATINGS
Operating Temperature
Ambient
Junction
V ESD1
V ESD2
V CDM
T A
T J
± 1500
± 200
± 750
-10 to 65
150
° C
Storage Temperature
T STG
-50 to 150
° C
Thermal Resistance
(4)
R θ JA
69
° C/W
Junction to Ambient
Lead Soldering Temperature (5)
T SOLDER
260
°C
Notes
1. VREF, DMAX1, DMAX2, SREGC1, SREGC2, SREGC3 and RESET1_TH.
2. Includes the series pass power supply circuit output current
3. ESD testing is performed in accordance with the Human Body Model (HBM) (C ZAP = 100 pF, R ZAP = 1500 ? ), the Machine Model (MM)
(C ZAP = 200 pF, R ZAP = 0 ? ), and the Charge Device Model (CDM), Robotic (C ZAP = 4.0pF).
4.
5.
Device mounted on a 2s2p test board, in accordance with JEDEC JESD51-6 and JESD51-7.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
18730
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
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