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| 型号： | MPC5534MZQ40 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROCONTROLLER, PBGA324 |
| 封装： | 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324 |
| 文件页数： | 50/60页 |
| 文件大小： | 1055K |
| 代理商： | MPC5534MZQ40 |
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MPC5534 Microcontroller Data Sheet, Rev. 5
Revision History for the MPC5534 Data Sheet
Freescale Semiconductor
54
The following table describes the changes made to information in tables and figures, and is presented in
sequential page number order.
Table 30. Table and Figure Changes Between Rev. 3.0 and 4.0
Location
Description of Changes
Figure 1, MPC5500 Family Part Numbers:
Removed the 2 in the tape and reel designator in both the graphic and in the Tape and Reel Status text.
Changed Qualification Status by adding ‘, general market flow’ to the M designator, and added an ‘S’ designator
with the description of ‘Fully spec. qualified, automotive flow.
Table 1, Orderable Part Numbers:
Footnote 1 added that reads: All devices are PPC5534, rather than MPC5534 or SPC5534, until product
qualifications are complete. Not all configurations are available in the PPC parts.
Reordered rows to group devices by lead-free package types in descending frequency order, and leaded
package types.
Footnote 2 added that reads:’ The lowest ambient operating temperature is referenced by TL; the highest ambient
operating temperature is referenced by TH.’
Footnote 3 added that reads: ‘Speed is the nominal maximum frequency. Max speed is the maximum speed
allowed including frequency modulation (FM). 42 MHz parts allow for 40 MHz system clock + 2% FM; 68 MHz
parts allow for 66 MHz system clock + 2% FM, and 82 MHz parts allow for 80 MHz system clock + 2% FM.’
Table 2, Absolute Maximum Ratings:
Deleted Spec 3, “Flash core voltage.”
Spec 12 “DC Input Voltage”: Deleted from second line‘. . .except for eTPUB[15] and SINB (DSPI_B_SIN)’ leaving
VDDEH powered I/O pads. Deleted third line ‘VDDEH powered by I/O pads (eTPUB[15] and SINB), including the
min. and max values of -0.3 and 6.5 respectively, and deleted old footnote 7.
Spec 12 “DC Input Voltage”: Added footnote 8 to second line “VDDE powered I/O pads” that reads: ‘Internal
structures hold the input voltage less than the maximum voltage on all pads powered by the VDDE supplies, if the
maximum injection current specification is met (s mA for all pins) and VDDE is within the operating voltage
specifications.
Spec 14, column 2, changed: ‘VSS differential voltage’ to ‘VSS to VSSA differential voltage.’
Spec 15, column 2, changed: ‘VDD differential voltage’ to ‘VDD to VDDA differential voltage.’
Spec 21, Added the name of the spec, ‘VRC33 to VDDSYN differential voltage,’ as well as the name and cross
reference to Table 9, DC Electrical Specifications, to which the Spec was moved.
Spec 28 “Maximum Solder Temperature”: Added two lines:
Lead free (PbFree) and Leaded (SnPb) with maximum values of 260 C and 245 C respectively.
Footnote 1, added: ‘any of’ between ‘beyond’ and ‘the listed maxima.’
Deleted footnote 2: ‘Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum
specifications for device stress have not yet been determined.’Spec 26 “Maximum Operating Temperature
Range”: replaced -40 C with.
Footnote 6 (now footnote 5): Changed the end of the last sentence as follows; “Internal structures hold the input
voltage greater than -1.0 V if the injection current limit of 2 mA is met. Keep the negative DC voltage greater than
-0.6 V on eTPU[15] and on SINB during the internal power-on reset (POR) state.”
Table 3, MPC5534 Thermal Characteristics:
Changed for production purposes, footnote 1 from:
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
to:
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal
resistance.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5534MZQ40R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MZQ66 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MZQ66R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MZQ80 | 功能描述:32位微控制器 - MCU 1MB FLASH POWERPC Z3 COR RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MPC5534MZQ80R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
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