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参数资料
| 型号： | MPC5553EVBE |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 68/68页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR MPC5553 |
| 产品培训模块： | MPC55xx PitchPak Family |
| 标准包装： | 1 |
| 类型： | MCU |
| 适用于相关产品： | MPC5553 |
| 所含物品： | 评估板和演示软件 |
| 配用： | MFR4310FRDC-ND - FRDC FLEXRAY DAUGHTER CARD |
| 相关产品： | MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA |
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Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
9
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Rd.
San Jose, CA., 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applica-
tions,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and
Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
3.3
Package
The MPC5553 is available in packaged form. Read the package options in Section 2, “Ordering
Information.” Refer to Section 4, “Mechanicals,” for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications 1
1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Spec
Characteristic
Minimum
Typical
Maximum
Unit
1
Scan range
0.15
—
1000
MHz
2
Operating frequency
—
fMAX
MHz
3VDD operating voltages
—
1.5
—
V
4VDDSYN, VRC33, VDD33, VFLASH, VDDE operating voltages
—
3.3
—
V
5VPP, VDDEH, VDDA operating voltages
—
5.0
—
V
6
Maximum amplitude
—
14 2
32 3
2 Measured with the single-chip EMI program.
3 Measured with the expanded EMI program.
dBuV
7
Operating temperature
—
25
oC
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5553EVBE | 制造商:Freescale Semiconductor 功能描述:MPC55xxEVB: MPC55xx Evaluation |
| MPC5553EVBGHS | 功能描述:开发软件 GREEN HILLS SW Qorivva RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5553EVBISYS | 功能描述:开发软件 ISYSTEMS CONTENT Qorivva RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5553MVF112 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF112R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
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