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| 型号： | MPC5554EVBISYS |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 55/58页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL ISYSTEMS MPC5554 |
| 标准包装： | 1 |
| 类型： | 微控制器 |
| 适用于相关产品： | MPC5554 |
| 所含物品： | 评估板和演示软件 |
| 相关产品： | MPC5554MZP132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MZP132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554AZP132-ND - IC MPU 2M FLASH 132MHZ 416-PBGA |
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MPC5554 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
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相关代理商/技术参数 |
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|---|---|
| MPC5554FS | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Qorivva MPC5554 Family |
| MPC5554INT | 功能描述:开发板和工具包 - 其他处理器 MPC5554 CUST. DEMO Qorivva RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC5554MVR112 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5554MVR132 | 功能描述:32位微控制器 - MCU MPC5554 COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MPC5554MVR132R2 | 功能描述:32位微控制器 - MCU COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
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