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参数资料
| 型号： | MPC5554EVBISYS |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 9/58页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL ISYSTEMS MPC5554 |
| 标准包装： | 1 |
| 类型： | 微控制器 |
| 适用于相关产品： | MPC5554 |
| 所含物品： | 评估板和演示软件 |
| 相关产品： | MPC5554MZP132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MZP132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554AZP132-ND - IC MPU 2M FLASH 132MHZ 416-PBGA |
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Electrical Characteristics
MPC5554 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
17
2 | V
DDA0 – VDDA1 | must be < 0.1 V.
3 V
PP can drop to 3.0 V during read operations.
4 If standby operation is not required, connect V
STBY to ground.
5 Applies to CLKOUT, external bus pins, and Nexus pins.
6 Maximum average RMS DC current.
7 Average current measured on automotive benchmark.
8 Peak currents can be higher on specialized code.
9 High use current measured while running optimized SPE assembly code with all code and data 100% locked in cache
(0% miss rate) with all channels of the eMIOS and eTPU running autonomously, plus the eDMA transferring data continuously from
SRAM to SRAM. Higher currents are possible if an “idle” loop that crosses cache lines is run from cache. Write code that avoids this
condition.
10 The current specification relates to average standby operation after SRAM has been loaded with data. For power up current see
11 Power requirements for the V
DD33 supply depend on the frequency of operation, load of all I/O pins, and the voltages on the I/O
segments. Refer to Table 11 for values to calculate the power dissipation for a specific operation.
12 Power requirements for each I/O segment are dependent on the frequency of operation and load of the I/O pins on a particular I/O
segment, and the voltage of the I/O segment. Refer to Table 10 for values to calculate power dissipation for specific operation. The
total power consumption of an I/O segment is the sum of the individual power consumptions for each pin on the segment.
13 Absolute value of current, measured at V
IL and VIH.
14 Weak pullup/down inactive. Measured at V
DDE = 3.6 V and VDDEH = 5.25 V. Applies to pad types: pad_fc, pad_sh, and pad_mh.
15 Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately one-half for each 8 oC
to 12 oC, in the ambient temperature range of 50 oC to 125 oC. Applies to pad types: pad_a and pad_ae.
16 V
SSA refers to both VSSA0 and VSSA1. | VSSA0 – VSSA1 | must be < 0.1 V.
17 Up to 0.6 V during power up and power down.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5554FS | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Qorivva MPC5554 Family |
| MPC5554INT | 功能描述:开发板和工具包 - 其他处理器 MPC5554 CUST. DEMO Qorivva RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC5554MVR112 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5554MVR132 | 功能描述:32位微控制器 - MCU MPC5554 COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MPC5554MVR132R2 | 功能描述:32位微控制器 - MCU COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
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