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参数资料
| 型号： | MPC5604SEMLQR |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP144 |
| 封装： | 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-144 |
| 文件页数： | 46/104页 |
| 文件大小： | 1729K |
| 代理商： | MPC5604SEMLQR |
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MPC560xS Microcontroller Data Sheet, Rev. 2
Preliminary—Subject to Change Without Notice
Electrical Characteristics
Freescale Semiconductor
46
RθJB
= junction-to-board thermal resistance (°C/W) per JESD51-8S
PD
= power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value for the junction
temperature is predictable. Ensure the application board is similar to the thermal test condition, with the component soldered to
a board with internal planes.
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal
resistance:
RθJA = RθJC + RθCA
Eqn. 3
where:
RθJA
= junction to ambient thermal resistance (°C/W)
RθJC
= junction to case thermal resistance (°C/W)
RθCA
= case to ambient thermal resistance (°C/W)
RθJC s device related and is not affected by other factors. The thermal environment can be controlled to change the
case-to-ambient thermal resistance, RθCA. For example, change the air flow around the device, add a heat sink, change the
mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to heat
sink to ambient. For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal resistance and the
junction-to-case thermal resistance. The junction-to-case thermal resistance describes when using a heat sink or where a
substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the
thermal performance when most of the heat is conducted to the printed circuit board. This model can be used to generate simple
estimations and for computational fluid dynamics (CFD) thermal models.
To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization
parameter (
ΨJT) to determine the junction temperature by measuring the temperature at the top center of the package case using
TJ = TT + (ΨJT x PD)
Eqn. 4
where:
TT
= thermocouple temperature on top of the package (°C)
ΨJT
= thermal characterization parameter (°C/W)
PD
= power dissipation in the package (W)
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests
on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from
the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling
effects of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA 94043 USA
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
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