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参数资料
| 型号： | MPC603PRX166LX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 27/40页 |
| 文件大小： | 431K |
| 代理商： | MPC603PRX166LX |
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PID7v-603e Hardware Specifications
33
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Notes:
1. Junction-to-ambient thermal resistance is based on measurements on single-sided printed circuit
boards per SEMI (Semiconductor Equipment and Materials International) G38-87 in natural
convection.
2. Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88
with the exception that the cold plate temperature is used for the case temperature.
The vendors who supply heat sinks are Aavid Engineering, IERC, Thermalloy, and Wakeeld Engineering.
Contact information for these vendors follows:
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Aavid Engineering
603-528-3400
One Kool Path
Laconic, NH 03247-0440
Wakeeld Engineering
617-245-5900
60 Audubon Rd.
Wakeeld, MA 01880
Any of these vendors can supply heat sinks with sufcient thermal performance.
1.8.6.2 IBM C4-CQFP Package
This section provides thermal management data for the 603e; this information is based on a typical desktop
conguration using a 240 lead, 32 mm x 32 mm, IBM C4-CQFP package. The heat sink used for this data
is a pinn conguration from Thermalloy, part number 2338 and a at aluminum plate with dimensions of
24 x 24 mm and 1.5 mm thickness.
1.8.6.2.1 Thermal Characteristics
The thermal characteristics for a C4-CQFP package are as follows:
Thermal resistance (junction-to-heat sink) = Rθjs or θjs = 0.03° C/Watt (junction-to-heat sink)
1.8.6.2.2 Thermal Management Example
The following example is based on a typical desktop conguration using an IBM C4-CQFP package. The
heat sink used for this data is a pinn heat sink #2338 attached to the C4-CQFP package with 2-stage epoxy.
The junction temperature can be calculated from the junction-to-ambient thermal resistance, as follows:
Junction temperature:
Tj = Ta + Rθja * P
or
Tj = Ta + (Rθjs + Rsa) * P
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