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参数资料
| 型号： | MPC603PRX225LX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 225 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 32/40页 |
| 文件大小： | 431K |
| 代理商： | MPC603PRX225LX |
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38
PID7v-603e Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Appendix A
General Handling Recommendations for the
C4-CQFP Package
The following list provides a few guidelines for package handling:
Handle the electrostatic discharge sensitive (ESD) package with care before, during, and after
processing.
Do not apply any load to exceed 3 Kg after assembly.
Components should not be hot-dip tinned.
The package encapsulation is an acrylated urethane. Use adequate ventilation (local exhaust) for all
elevated temperature processes.
The package parameters are as follows:
Heat sink adhesive
AIEG-7655
IBM reference drawing
99F4869
Test socket
Yamaichi QFP-PO 0.5-240P
Signal
165
Power/ground
75
Total
240
A.1 Package Environmental, Operation, Shipment,
and Storage Requirements
The environmental, operation, shipment, and storage requirements are as follows:
Make sure that the package is suitable for continuous operation under business ofce environments.
— Operating environment: 10
° C to 40° C, 8% to 80% relative humidity
— Storage environment: 1
° C to 60° C, up to 80% relative humidity
— Shipping environment: 40
° C to 60° C, 5% to 100% relative humidity
This component is qualied to meet JEDEC moisture Class 2.
After expiration of shelf life, packages may be baked at 120
° C (+10/–5° C) for 4 hours minimum
and then be used or repackaged. Shelf life is as specied by JEDEC for moisture Class 2
components.
A.2 Card Assembly Recommendations
This section provides recommendations for card assembly process. Follow these guidelines for card
assembly.
This component is supported for aqueous, IR, convection reow, and vapor phase card assembly
processes.
The temperature of packages should not exceed 220
° C for longer than 5 minutes.
The package entering a cleaning cycle must not be exposed to temperature greater than that
occurring during solder reow or hot air exposure.
It is not recommended to re-attach a package that is removed after card assembly.
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For More Information On This Product,
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相关代理商/技术参数 |
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| MPC603RRX200LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX200TC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX266LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX266TC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX300LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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