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参数资料
| 型号： | MPC7410RX500LX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 32/44页 |
| 文件大小： | 885K |
| 代理商： | MPC7410RX500LX |
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38
MPC7410 RISC Microprocessor Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
International Electronic Research Corporation (IERC) 818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
Wakefield Engineering
617-245-5900
60 Audubon Rd.
Wakefield, MA 01880
Aavid Engineering
603-528-3400
One Kool Path
Laconia, NH 03247-0440
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.8.9.1 Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 25 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 25. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
External Resistance
Internal Resistance
Note the internal versus external package resistance.
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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相关代理商/技术参数 |
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| MPC7410THX400LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
| MPC7410THX450NE | 功能描述:微处理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410THX500LE | 功能描述:微处理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410TRX400NE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum |
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