参数资料
型号: MPC7410THX500LE
厂商: Freescale Semiconductor
文件页数: 3/56页
文件大小: 0K
描述: IC MPU 32BIT 500MHZ 360-CBGA
标准包装: 44
系列: MPC74xx
处理器类型: 32-位 MPC74xx PowerPC
速度: 500MHz
电压: 1.8V
安装类型: 表面贴装
封装/外壳: 360-BBGA,FCCBGA
供应商设备封装: 360-FCCBGA(25x25)
包装: 托盘
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 5 provides the DC electrical characteristics for the MPC7410.
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the active portion of the die and the calculated case temperature at the top of the die.
The actual value of R JC is less than 0.1 °C/W.
Note: Refer to Section 8.8, “Thermal Management Information,” for details on thermal management.
Table 5. DC Electrical Specifications
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except
SYSCLK)
1.8
VIH
0.65
× (L2)OVDD
(L2)OVDD + 0.2
V
2, 3, 8
2.5
VIH
1.7
(L2)OVDD + 0.2
3.3
VIH
2.0
OVDD + 0.3
Input low voltage (all inputs except
SYSCLK)
1.8
VIL
–0.3
0.35
× (L2)OVDD
V8
2.5
VIL
–0.3
0.2
× (L2)OVDD
3.3
VIL
–0.3
0.8
SYSCLK input high voltage
1.8
CVIH
1.5
OVDD + 0.2
V
2, 8
2.5
CVIH
2.0
OVDD + 0.2
3.3
CVIH
2.4
OVDD + 0.3
SYSCLK input low voltage
1.8
CVIL
–0.3
0.2
V
8
2.5
CVIL
–0.3
0.4
3.3
CVIL
–0.3
0.4
Input leakage current,
Vin = L2OVDD/OVDD
1.8
Iin
—20
A
2, 3,
6, 7
2.5
Iin
—35
3.3
Iin
—70
Table 4. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
相关PDF资料
PDF描述
IDT70V07S25PF8 IC SRAM 256KBIT 25NS 80TQFP
IDT70261S35PF8 IC SRAM 256KBIT 35NS 100TQFP
IDT70261S25PF8 IC SRAM 256KBIT 25NS 100TQFP
MPC8572ECPXARLD MPU POWERQUICC III 1023-PBGA
IDT70261S20PF8 IC SRAM 256KBIT 20NS 100TQFP
相关代理商/技术参数
参数描述
MPC7410TRX400NE 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410TRX450NE 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410VS400LE 功能描述:微处理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC7410VS400NE 功能描述:微处理器 - MPU REV 1.4 105C LGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC7410VS450LE 功能描述:微处理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324