- 您现在的位置：买卖IC网 > PDF目录45353 > MPC7410VS400LE (FREESCALE SEMICONDUCTOR INC) 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 PDF资料下载
参数资料
| 型号： | MPC7410VS400LE |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, LGA-360 |
| 文件页数： | 39/56页 |
| 文件大小： | 864K |
| 代理商： | MPC7410VS400LE |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页当前第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
44
Freescale Semiconductor
System Design Information
8.8.1 Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3, the intrinsic conduction thermal resistance paths are
as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit
board.
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air convection.
Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the silicon may
be neglected. Thus, the heat sink attach material and the heat sink conduction/convective thermal resistances are the
dominant terms.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
8.8.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism, Figure 29 shows
the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare
joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal
interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the
interface thermal resistance. That is, the bare joint results in a thermal resistance approximately seven times greater
than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 26).
This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers the best thermal
performance, considering the low interface pressure. Of course, the selection of any thermal interface material
depends on many factors—thermal performance requirements, manufacturability, service temperature, dielectric
properties, cost, and so on.
External Resistance
Internal Resistance
Note the internal versus external package resistance.
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
相关PDF资料 |
PDF描述 |
|---|---|
| MPC7410HX500LE | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410THX500LE | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410RX400LC | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410RX400LD | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410VS450LE | 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC7410VS400NE | 功能描述:微处理器 - MPU REV 1.4 105C LGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410VS450LE | 功能描述:微处理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410VS450NE | 功能描述:微处理器 - MPU REV 1.4 105C LGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7410VS500LE | 功能描述:微处理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC7441 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。