参数资料
型号: MPC7410VS500LE
厂商: Freescale Semiconductor
文件页数: 3/56页
文件大小: 0K
描述: IC MPU PPC 500MHZ 360-FCCLGA
标准包装: 44
系列: MPC74xx
处理器类型: 32-位 MPC74xx PowerPC
速度: 500MHz
电压: 1.8V
安装类型: 表面贴装
封装/外壳: 360-CLGA,FCCLGA
供应商设备封装: 360-FCCLGA(25x25)
包装: 托盘
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 5 provides the DC electrical characteristics for the MPC7410.
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the active portion of the die and the calculated case temperature at the top of the die.
The actual value of R JC is less than 0.1 °C/W.
Note: Refer to Section 8.8, “Thermal Management Information,” for details on thermal management.
Table 5. DC Electrical Specifications
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except
SYSCLK)
1.8
VIH
0.65
× (L2)OVDD
(L2)OVDD + 0.2
V
2, 3, 8
2.5
VIH
1.7
(L2)OVDD + 0.2
3.3
VIH
2.0
OVDD + 0.3
Input low voltage (all inputs except
SYSCLK)
1.8
VIL
–0.3
0.35
× (L2)OVDD
V8
2.5
VIL
–0.3
0.2
× (L2)OVDD
3.3
VIL
–0.3
0.8
SYSCLK input high voltage
1.8
CVIH
1.5
OVDD + 0.2
V
2, 8
2.5
CVIH
2.0
OVDD + 0.2
3.3
CVIH
2.4
OVDD + 0.3
SYSCLK input low voltage
1.8
CVIL
–0.3
0.2
V
8
2.5
CVIL
–0.3
0.4
3.3
CVIL
–0.3
0.4
Input leakage current,
Vin = L2OVDD/OVDD
1.8
Iin
—20
A
2, 3,
6, 7
2.5
Iin
—35
3.3
Iin
—70
Table 4. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
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