参数资料
型号: MPC755CPX400LER2
厂商: Freescale Semiconductor
文件页数: 13/56页
文件大小: 0K
描述: MCU HIP4DP 400MHZ 360-PBGA
标准包装: 150
系列: MPC7xx
处理器类型: 32-位 MPC7xx PowerPC
速度: 400MHz
电压: 2V
安装类型: 表面贴装
封装/外壳: 360-BBGA,FCCBGA
供应商设备封装: 360-FCCBGA(25x25)
包装: 带卷 (TR)
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
20
Freescale Semiconductor
Electrical and Thermal Characteristics
Figure 8 shows the L2 bus input timing diagrams for the MPC755.
Figure 8. L2 Bus Input Timing Diagrams
L2SYNC_IN to high impedance:
All outputs when L2CR[14–15] = 00
All outputs when L2CR[14–15] = 01
All outputs when L2CR[14–15] = 10
All outputs when L2CR[14–15] = 11
tL2CHOZ
2.4
2.6
2.8
3.0
ns
3, 5
Notes:
1. Rise and fall times for the L2SYNC_IN input are measured from 20% to 80% of L2OVDD.
2. All input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the rising edge of
the input L2SYNC_IN (see Figure 8). Input timings are measured at the pins.
3. All output specifications are measured from the midpoint voltage of the rising edge of L2SYNC_IN to the midpoint of the
signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-
Ω load (see
4. The outputs are valid for both single-ended and differential L2CLK modes. For pipelined registered synchronous BurstRAMs,
L2CR[14–15] = 01 or 10 is recommended. For pipelined late write synchronous BurstRAMs, L2CR[14–15] = 11 is
recommended.
5. Guaranteed by design and characterization.
6. Revisions prior to Rev. 2.8 (Rev. E) were limited in performance and did not conform to this specification. For more
Table 12. L2 Bus Interface AC Timing Specifications (continued)
At recommended operating conditions (see Table 3)
Parameter
Symbol
All Speed Grades
Unit
Notes
Min
Max
L2SYNC_IN
L2 Data and Data
VM
VM = Midpoint Voltage (L2OVDD/2)
tDVL2CH
tDXL2CH
tL2CR
tL2CF
Parity Inputs
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参数描述
MPC755CRX350LE 功能描述:微处理器 - MPU 360CBGA,RV2.8,6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC755CRX350TE 功能描述:微处理器 - MPU 360CBGA,RV2.8, RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC755CRX400LE 功能描述:微处理器 - MPU GF RV2.84A105C 360CBGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC755CRX400TE 功能描述:微处理器 - MPU GF RV2.84A-40C 360CBGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC755CVT350LE 功能描述:微处理器 - MPU GF RV2.8,4A,105C,6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324