参数资料
型号: MPC8245LVV333D
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352
封装: 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
文件页数: 60/68页
文件大小: 465K
代理商: MPC8245LVV333D
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
63
Ordering Information
9.2
Part Numbers Not Fully Addressed by This Document
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications that supplement and supersede this document. Table 21
shows the part numbers addressed by the MPC8245TXXnnnx series. The revision level can be determined
by reading the Revision ID register at address offset 0x08.
Table 22 shows the part numbers addressed by the MPC8245ARZUnnnx series.
Table 21. Part Numbers Addressed by MPC8245TXXnnnx Series
Part Number Specification Markings
(Document Order No. MPC8245ECS01AD)
MPC
nnnn
X
xx
nnn
x
Product
Code
Part
Identifier
Process
Descriptor
Package 1
Processor
Frequency 2
Revision Level
Processor
Version
Register Value
MPC
8245
T: –40
°
to 105
°C
ZU = TBGA
V V= Lead-free
TBGA
266 MHz, 300 MHz:
1.7 V to 2.1 V
333 MHz, 350 MHz:
1.9 V to 2.2 V
D:1.4 Rev ID:0x14
0x80811014
Notes:
1. See Section 5, “Package Description,for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by a hardware specifications addendum may
support other maximum core frequencies.
Table 22. Part Numbers Addressed by MPC8245ARZUnnnx Series
Part Number Specification Markings
(Document Order No. MPC8245ECS02AD)
MPC
nnnn
X
xx
nnn
x
Product
Code
Part
Identifier
Process 3
Identifier
Process
Descriptor
Package 1
Processor
Frequency 2
Revision Level
Processor
Version
Register
Value
MPC
8245
A
R: 0
° to 85°CZU = TBGA
V V= Lead-free
TBGA
400 MHz
2.1 V ±
100 mV
D:1.4 Rev ID:0x14
0x80811014
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by a hardware specifications addendum may
support other maximum core frequencies.
3. Process identifier ‘A’ represents parts that are manufactured under a 29-angstrom process verses the original 35-angstrom
process.
相关PDF资料
PDF描述
MPC8245TVV300D 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352
MPC8245ARVV400D 32-BIT, 400 MHz, RISC PROCESSOR, PBGA352
MPC8245TZU333D 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352
MPC8245TVV350D 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352
MPC8245TVV300D 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352
相关代理商/技术参数
参数描述
MPC8245LVV350D 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8245LZU266D 功能描述:微处理器 - MPU 266MHz 505.4MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8245LZU300D 功能描述:微处理器 - MPU 300MHz 570MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8245LZU333D 功能描述:微处理器 - MPU 333MHz 632.7MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8245LZU350D 功能描述:微处理器 - MPU 350MHz 665MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324