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参数资料
| 型号： | MPC8245TZU333D |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 46/68页 |
| 文件大小： | 0K |
| 描述： | IC MPU 32BIT 333MHZ 352-TBGA |
| 标准包装： | 24 |
| 系列： | MPC82xx |
| 处理器类型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 333MHz |
| 电压： | 2V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 352-LBGA |
| 供应商设备封装： | 352-TBGA（35x35） |
| 包装： | 托盘 |
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MPC8245 Integrated Processor Hardware Specifications, Rev. 10
50
Freescale Semiconductor
System Design
7.8
Thermal Management
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, heat sinks
may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: the heat sink, airflow, and thermal interface material. To
reduce the die-junction temperature, heat sinks can be attached to the package by several methods:
adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly.
Figure 27 displays a package-exploded cross-sectional view of a TBGA package with several heat sink
options.
Figure 27. Package-Exploded Cross-Sectional View with Several Heat Sink Options
Figure 28 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
from adjacent components.
A heat sink is not attached to the TBGA package, and there is low board-level thermal loading from
adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is high
board-level thermal loading from adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is low
board-level thermal loading from adjacent components.
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Adhesive or
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相关代理商/技术参数 |
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| MPC8245TZU350D | 功能描述:微处理器 - MPU 350MHz 665MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8247 | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8247CVR | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8247CVRB | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8247CVRE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
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