- 您现在的位置：买卖IC网 > PDF目录4068 > MPC8248CZQTIEA (Freescale Semiconductor)IC MPU POWERQUICC II 516-PBGA PDF资料下载
参数资料
| 型号： | MPC8248CZQTIEA |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/61页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC II 516-PBGA |
| 标准包装： | 40 |
| 系列： | MPC82xx |
| 处理器类型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 400MHz |
| 电压： | 1.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 516-BBGA |
| 供应商设备封装： | 516-FPBGA（27x27） |
| 包装： | 托盘 |
第1页第2页第3页第4页第5页当前第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
14
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
This table describes thermal characteristics. See Table 2 for information on a given SoC’s package.
Discussions of each characteristic are provided in Section 4.1, “Estimation with Junction-to-Ambient
Thermal Resistance,” through Section 4.7, “References.” For the these discussions, PD =(VDD × IDD) +
PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
4 MPC8280, MPC8275VR, MPC8275ZQ only.
Table 7. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board1
1 Assumes no thermal vias
RθJA
27
°C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
RθJA
19
°C/W
Natural convection
16
1 m/s
Junction-to-board2
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
11
°C/W
—
Junction-to-case3
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
RθJC
8
°C/W
—
Junction-to-package top4
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
RθJT
2
°C/W
—
相关PDF资料 |
PDF描述 |
|---|---|
| ABB92DHAT-S250 | CONN EDGECARD 184POS R/A .050 SL |
| CS80C286-16 | IC CPU 16BIT 5V 16MHZ 68-PLCC |
| ACB90DHAR | CONN EDGECARD 180PS R/A .050 DIP |
| MPC857TZQ66B | IC MPU PWRQUICC 66MHZ 357-PBGA |
| ABB95DHAS | CONN EDGECARD 190PS R/A .050 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8248VR | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248VRB | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8248VRE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8248VRI | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8248VRM | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。