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参数资料
| 型号： | MPC8250AZQIHBC |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516 |
| 封装： | 27 X 27 MM, 1.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516 |
| 文件页数： | 3/73页 |
| 文件大小： | 885K |
| 代理商： | MPC8250AZQIHBC |
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MOTOROLA
MPC8250 Hardware Specications
11
Electrical and Thermal Characteristics
1.2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 F
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND planes.
All output pins on the MPC8250 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize overdamped conditions and reections caused by these
fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs
during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
Table 5 provides preliminary, estimated power dissipation for various congurations. Note that suitable
thermal management is required for conditions above PD = 3W (when the ambient temperature is 70 C or
greater) to ensure the junction temperature does not exceed the maximum specied value. Also note that the
I/O power should be included when determining whether to use a heat sink.
1.2.4
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and
inputs for the 66 MHz MPC8250 device. Note that AC timings are based on a 50-pf load. Typical output
buffer impedances are shown in Table 6.
Table 5. Estimated Power Dissipation for Various Congurations1
1 Test temperature = room temperature (25 C)
Bus
(MHz)
CPM
Multiplier
Core CPU
Multiplier
CPM
(MHz)
CPU
(MHz)
PINT(W)
2
2 P
INT = IDD x VDD Watts
Vddl 1.8 Volts
Vddl 2.0 Volts
Nominal
Maximum
Nominal
Maximum
66.66
2
3
133
200
1.2
2
1.8
2.3
66.66
2.5
3
166
200
1.3
2.1
1.9
2.3
66.66
3
4
200
266
—
2.3
2.9
66.66
3
4.5
200
300
—
2.4
3.1
83.33
2
3
166
250
—
2.2
2.8
83.33
2
3
166
250
—
2.2
2.8
83.33
2.5
3.5
208
291
—
2.4
3.1
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