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参数资料
| 型号： | MPC8260ACZUMIBB |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA480 |
| 封装： | 37.50 X 37.50 MM, TBGA-480 |
| 文件页数： | 2/40页 |
| 文件大小： | 527K |
| 代理商： | MPC8260ACZUMIBB |
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10
MPC8260 (HiP3) Hardware Specications
MOTOROLA
Electrical and Thermal Characteristics
All output pins on the MPC8260 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize overdamped conditions and reections caused by these
fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs
during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
Table 5 provides preliminary, estimated power dissipation for various congurations. Note that suitable
thermal management is required for conditions above PD = 3W (when the ambient temperature is 70 C or
greater) to ensure the junction temperature does not exceed the maximum specied value. Also note that the
I/O power should be included when determining whether to use a heat sink.
1.2.4
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and
inputs for the 66 MHz MPC8260 device. Note that AC timings are based on a 50-pf load. Typical output
buffer impedances are shown in Table 6.
Table 5. Estimated Power Dissipation for Various Congurations1
1 Test temperature = room temperature (25 C)
Bus
(MHz)
CPM
Multiplier
CPU
Multiplier
CPM
(MHz)
CPU
(MHz)
PINT (W)
2
2 P
INT = IDD x VDD Watts
Vddl
2.4
2.5
2.6
2.7
2.83
3 2.8 Vddl does not apply to HiP3 Rev C silicon.
33.3
4
133.3
2.04
2.14
2.26
2.38
2.50
50.0
2
3
100
150.0
2.21
2.30
2.45
2.59
2.69
66.7
2
2.5
133.3
166.7
2.47
2.62
2.74
2.88
3.02
66.7
2.5
166.7
2.57
2.69
2.83
2.98
3.12
66.7
2
3
133.3
200.0
2.81
2.95
3.12
3.29
3.43
66.7
2.5
3
166.7
200.0
2.88
3.05
3.22
3.38
3.55
50.0
3
4
150
200.0
2.83
3.00
3.14
3.31
3.48
Table 6. Output Buffer Impedances1
1 These are typical values at 65 C. The impedance may vary
by ±25% with process and temperature.
Output Buffers
Typical Impedance (
)
60x bus
40
Local bus
40
Memory controller
40
Parallel I/O
46
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